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Open roles at Micron Technology, page 39

  • Engineer CE PYE (Physical Failure Analysis/Fault Isolation) in Singapore
  • QE Engineer in Taiwan
  • Principal Engineer- HIG HBM Layout in Hyderabad, Telangana, India
  • Principal Engineer- HIG HBM Layout in Hyderabad
  • STAFF ENGINEER, MODULE HW VAL in Hyderabad, Telangana, India
  • Senior Member of Technical Staff (SMTS) – Process Development, CMP, NAND in Singapore
  • Staff Engineer, HIG HBM Layout in Hyderabad
  • 2026.02_IPDev_Layout_1 in Japan
  • Staff Engineer, HIG HBM Layout in Hyderabad, Telangana, India
  • Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND in Singapore
  • Principal Engineer, Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) in Singapore
  • MTS, HIG-HBM Layout in Hyderabad
  • Staff Memory Design Engineer, HBM in Texas, United States
  • Engineer - PIE YE in Singapore
  • Senior Manager, Front End Manufacturing Alignment in Boise
  • MTS, AI Engineering, SMAI in Taiwan
  • TECHNOLOGIST - MFG EQUIPMENT in Singapore
  • STAFF DATA SCIENTIST in Singapore
  • CMP PROCESS ENGINEER in Taiwan
  • HBM SoC Physical Design Engineer in United States
  • Layout Engineer, DEG Layout in Hyderabad
  • Staff/Principal Engineer, NAND TD, RDA in Singapore
  • Technician, WH in Taiwan
  • Manufacturing Equipment/Production Engineer in Singapore
  • Engineer, HIG HBM Layout in Hyderabad
  • Films Process Development Engineer in United States
  • ENGINEER, QEM PQE QUALITY in Singapore
  • IT System Engineer (Server and Virtualization) in Taiwan
  • Films Process Development Engineer in Boise
  • SR DATA SCIENTIST SMART MFG & AI in Taiwan
  • DATA SCIENTIST SMART MFG & AI｜New College Graduates Welcome in Taiwan
  • Lead Principal Engineer, Layout Design in Mexico
  • Engineer, FST WH in Taiwan
  • TECHNICIAN, PROD. ( Tongluo) in Taiwan
  • Sr Process Integration Engineer, DRAM in Boise, Idaho
  • Senior Global Frontend Capital Category Supplier Manager, Spares in Taiwan
  • PRINCIPAL DATA SCIENTIST in Singapore
  • Principal Process Engineer, Die Bonding in Boise
  • Staff Engineer – Process Development, Wet, NAND in Singapore
  • JR100843 Staff Engineer – Process Development, Wet, NAND in Singapore
  • Senior Member of Technical Staff (SMTS) – Process Development, Thin Films (CVD/Diffusion), NAND in Singapore
  • Principal Engineer – Process Development, Wet, NAND in Singapore
  • Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND in Singapore
  • Senior Member of Technical Staff (SMTS) – Process Development, Wet, NAND in Singapore
  • Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND in Singapore
  • Principal Engineer – Process Development, Dry Etch, NAND in Singapore
  • Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND in Singapore
  • Distinguished Member of Technical Staff (DMTS) – Process Development, Thin Films (CVD/Diffusion), NAND in Singapore
  • Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND in Singapore
  • Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND in Singapore

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