Principal HBM Design Architect

Micron Technology
United States
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 7+ yearsEducation: bachelorsSkills: ["Analytical","Debugging","Problem-solving","Communication","Collaboration"]

Design, simulate, optimize, and floorplan advanced DRAM circuits for next-generation High Bandwidth Memory (HBM) products. Own block-level and full-chip functional evaluation, analyze timing/area/power trade-offs, and lead feasibility studies for new architectures. Work across digital, analog, and mixed-signal domains with globally distributed teams supporting AI/ML HBM solutions, including TSV-based 3D stacking and silicon validation.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Principal HBM Design Architect

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Design, simulate, optimize, and floorplan advanced DRAM circuits for next-generation High Bandwidth Memory (HBM) products. Own block-level and full-chip functional evaluation, analyze timing/area/power trade-offs, and lead feasibility studies for new architectures. Work across digital, analog, and mixed-signal domains with globally distributed teams supporting AI/ML HBM solutions, including TSV-based 3D stacking and silicon validation.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Design, simulate, and optimize DRAM memory arrays, data paths, ECC, command/control logic, and high-speed interface circuits
  • •Evaluate block-level and full-chip functionality and propose solutions to ensure functional correctness
  • •Analyze timing, area, power, and complexity trade-offs in high-speed DRAM and mixed-signal designs
  • •Perform pathfinding and feasibility studies for new architectures and future HBM products
  • •Support large-scale verification, debug, and silicon validation activities while collaborating on TSV-based 3D stacking and vertical integration

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid HolidaysPaid Time-offParental Leave

Key Requirements

  • •BSEE with 7+ years or MSEE with 5+ years of relevant engineering experience
  • •Strong knowledge of CMOS circuit design and semiconductor device physics
  • •Experience with schematic entry and simulation using FineSim, HSPICE, or equivalent tools
  • •Experience with power delivery and power network analysis
  • •Proficiency in scripting languages such as Python, Tcl, or Perl
Experience:7+ yearsSemiconductorsDRAMHBMAI/ML
Education:Bachelor's
Skills:AnalyticalDebuggingProblem-solvingCommunicationCollaboration
Tech Stack:HBMDRAMCMOSFineSimHSPICEPythonTclPerlECCPower deliveryPower network analysisTSV3D stackingMixed-signal

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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