Engineer , Pkg Reliability

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Data Analytics & Business IntelligenceExperience: 1-2 yearsEducation: bachelorsSkills: ["Analytical problem-solving","Project management","Written communication","Verbal communication","Cross-functional collaboration","Self-motivation","Meticulous attention to detail"]

Ensure quality and reliability of semiconductor packages across assigned product lines by owning end-to-end package qualification for new products, designs, materials, and processes. Plan and execute reliability tests, recommend screening and release readiness based on results, and maintain monitoring systems. Drive 8D root-cause analysis and corrective actions for qualification failures and customer RMAs, and serve as a technical liaison to internal teams and external customers.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Engineer , Pkg Reliability

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Ensure quality and reliability of semiconductor packages across assigned product lines by owning end-to-end package qualification for new products, designs, materials, and processes. Plan and execute reliability tests, recommend screening and release readiness based on results, and maintain monitoring systems. Drive 8D root-cause analysis and corrective actions for qualification failures and customer RMAs, and serve as a technical liaison to internal teams and external customers.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Data Analytics & Business Intelligence
Seniority: Entry level

Key Responsibilities

  • •Lead and coordinate package qualification for new products and process introductions, including qualification plan development for new technologies and developments.
  • •Develop and execute reliability test planning, screening methodologies, and ongoing monitoring systems to maintain package quality.
  • •Recommend release readiness and technical recommendations based on comprehensive reliability test outcomes.
  • •Participate in 8D problem-solving to investigate qualification failures and customer RMAs and coordinate corrective action plans.
  • •Serve as a technical liaison to internal teams and external customers on package quality and reliability concerns, including evaluating customer requests.

Key Requirements

  • •Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field.
  • •1-2 years of experience in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis.
  • •Knowledge of semiconductor package assembly processes and surface mount technology.
  • •Understanding of thermo-mechanical, mechanical, and material interactions affecting reliability in IC components and PCB assemblies.
  • •Proficiency with reliability test methods, life prediction acceleration models, and statistical sampling; familiarity with SPC, FMEA, and 8D/CAR.
Experience:1-2 yearsSemiconductorsMicroelectronicsQualityReliabilityFailure analysisSemiconductor packagingSurface mount technology
Education:Bachelor's in Mechanical, Electronics, Materials Science
Skills:Analytical problem-solvingProject managementWritten communicationVerbal communicationCross-functional collaborationSelf-motivationMeticulous attention to detail
Languages:English
Tech Stack:C++AutoCADSPCFMEA8DCAPANumerical data analysisLife predictionStatistical sampling

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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