Staff Engineer, APTD Dry Etch

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 3+ yearsEducation: bachelorsSkills: ["Independent work","Data analysis","Problem-solving"]

Develop and optimize dry etch plasma process modules for advanced packaging products, improving performance, yield, and reliability. Drive process capability and cost/variability improvements through data-driven experimentation and equipment innovation. Partner with Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding teams to resolve complex process and hardware challenges, and support process transfer and readiness for high-volume manufacturing.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
1 month ago

Staff Engineer, APTD Dry Etch

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Develop and optimize dry etch plasma process modules for advanced packaging products, improving performance, yield, and reliability. Drive process capability and cost/variability improvements through data-driven experimentation and equipment innovation. Partner with Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding teams to resolve complex process and hardware challenges, and support process transfer and readiness for high-volume manufacturing.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products.
  • •Improve process capability, cost, and variability using data-driven experimentation and equipment innovation.
  • •Collaborate with process integration and adjacent teams (Wet Etch, Films, Lithography, CMP, Wafer Trim, Bonding).
  • •Perform root-cause and failure-mode analysis and work with equipment vendors to resolve complex process and hardware challenges.
  • •Support global process transfer and readiness for high-volume manufacturing, including occasional international travel.
Travel: Low travel

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering, or related field with 5+ years of relevant dry etch experience.
  • •OR Master’s or PhD in a related discipline with 3+ years of relevant dry etch experience in the semiconductor industry.
  • •Hands-on R&D experience advancing process performance through structured experimentation.
  • •Ability to apply DOE, data analysis, and first-principles reasoning to complex process problems.
  • •Ability to work independently while managing multiple technical priorities and program commitments.
Experience:3+ yearsSemiconductor
Education:Bachelor's
Skills:Independent workData analysisProblem-solving
Tech Stack:Python

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn