Principal Design Engineer, HBM

Micron Technology
Texas
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Experience: 8+ yearsEducation: bachelorsSkills: ["Communication","Cross-functional leadership","Technical leadership","Root-cause analysis"]

Lead cross-functional HBM product design and sustaining activities for high-volume memory used in AI/ML and HPC. Drive silicon debugging, root-cause analysis, and system-level stability across domains, ensuring ECO implementation, verification closure, and long-term maintainability. Identify issues impacting quality, yield, reliability, and performance, and support critical customer escalations and system bring-up. Shape future HBM architecture, design, and verification methodologies through technical leadership.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Principal Design Engineer, HBM

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Last checked: 19 hours agoStatus: Live

Job Summary

Lead cross-functional HBM product design and sustaining activities for high-volume memory used in AI/ML and HPC. Drive silicon debugging, root-cause analysis, and system-level stability across domains, ensuring ECO implementation, verification closure, and long-term maintainability. Identify issues impacting quality, yield, reliability, and performance, and support critical customer escalations and system bring-up. Shape future HBM architecture, design, and verification methodologies through technical leadership.
Location: Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Sr. Manager level

Key Responsibilities

  • •Own HBM product design health through the sustaining phase, including ECO implementation, verification, and maintainability.
  • •Define debug strategies and serve as a technical authority for HBM sustaining efforts.
  • •Lead root-cause analysis and resolution of complex silicon, system, and customer issues to closure.
  • •Drive alignment and execution across DE, PE, TD, and system teams to deliver efficient issue resolution.
  • •Lead initiatives to improve yield, reliability, and performance and handle critical customer escalations and system bring-up support.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •8+ years with a BS or 6+ years with an MS in Electrical/Computer Engineering or a related field.
  • •Deep expertise in HBM/DRAM architecture and high-speed memory interfaces.
  • •Strong experience in silicon debug, system-level analysis, and root-cause resolution.
  • •Proven ability to lead complex technical problems across cross-functional teams.
  • •Strong background in digital and/or custom design and verification.
Experience:8+ yearsHBMDRAMAI/MLHigh-performance computingSemiconductors
Education:Bachelor's in Electrical/Computer Engineering
Skills:CommunicationCross-functional leadershipTechnical leadershipRoot-cause analysis
Tech Stack:HBMDRAMHigh-speed memory interfacesECOVerificationDFTMBISTPythonSI/PITimingMarginingSystem-level analysisSilicon correlation

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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