Structural, Thermal & Packaging Analyst (Semiconductor FEA) IV

Lead and execute R&D and engineering projects for semiconductor structural, thermal, and packaging technologies, defining experiments and determining meaningful data needs. Drive complex system work, module/sub-module design and qualification, and provide expert troubleshooting for physics-related system issues in lab and field. Review system and sub-system requirements, plan feasibility studies for new technologies, support vendor/module strategy, mentor less-experienced scientists, and share findings through papers and technical presentations.