Texas Instruments

3 months ago

Device/Process Integration Engineer (R&D)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 12 hours agoStatus: Live

Job Summary

Drive semiconductor device and process technology development for embedded and analog products, improving parametric performance and yield for 28nm and 22nm nodes. Lead engineers in defining process requirements, specifications, and scorecards for a section of the process flow. Use characterization, DOE, data analysis, and simulation to advance process and device improvements, mentor engineers, and partner across process, integration, reliability, packaging, test, and product teams to meet program goals.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Research & Scientific (R&D)

Key Responsibilities

•Apply semiconductor device physics and model-based problem solving to resolve complex integration issues and improve parametric performance and yield.
•Lead a team of engineers to develop a section of the process flow by defining process requirements, specifications, and scorecards.
•Drive process and device improvements using characterization, test, DOE, data analysis, and simulation.
•Mentor engineers and share process-integration best-known methods for HKMG sub‑28nm nodes.
•Partner across process, integration, reliability, packaging, and test engineering teams, and work with product groups to optimize process performance to meet final device parameters.

Key Requirements

•Master’s in Electrical Engineering, Electrical and Computer Engineering, or a semiconductor-focused discipline (e.g., solid-state physics, applied physics, quantum mechanics).
•10+ years working in a semiconductor factory environment developing advanced CMOS devices for next-generation nodes below 28nm.
•Demonstrated strength in DOE, data analysis, and translating results into process and parametric improvements.
•Ability to plan effectively, drive schedules, and meet critical deadlines on multiple tasks in parallel.
•Strong communication and cross-functional collaboration across organizational boundaries, including leading technical discussions.

Experience:10+ yearsSemiconductor manufacturingAnalogEmbedded systemsCMOSWafer fabrication

Education:Master's in Electrical Engineering; Electrical and Computer Engineering; semiconductor-focused discipline

Skills:CommunicationCross-functional collaborationTechnical leadershipProblem-solvingMentorship

Tech Stack:Semiconductor device physicsModel-based problem solvingProcess-flow integrationParametric and yield improvementsCharacterizationDesign of experiments (DOE)Data analysisSimulationHigh‑k metal gate (HKMG)CMOS

Company Brief

Texas Instruments

Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Dallas, United States

Founded: 1930

Website LinkedIn

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Texas Instruments

3 months ago

Device/Process Integration Engineer (R&D)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 12 hours agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Research & Scientific (R&D)

Key Responsibilities

•Apply semiconductor device physics and model-based problem solving to resolve complex integration issues and improve parametric performance and yield.
•Lead a team of engineers to develop a section of the process flow by defining process requirements, specifications, and scorecards.
•Drive process and device improvements using characterization, test, DOE, data analysis, and simulation.
•Mentor engineers and share process-integration best-known methods for HKMG sub‑28nm nodes.
•Partner across process, integration, reliability, packaging, and test engineering teams, and work with product groups to optimize process performance to meet final device parameters.

Key Requirements

•Master’s in Electrical Engineering, Electrical and Computer Engineering, or a semiconductor-focused discipline (e.g., solid-state physics, applied physics, quantum mechanics).
•10+ years working in a semiconductor factory environment developing advanced CMOS devices for next-generation nodes below 28nm.
•Demonstrated strength in DOE, data analysis, and translating results into process and parametric improvements.
•Ability to plan effectively, drive schedules, and meet critical deadlines on multiple tasks in parallel.
•Strong communication and cross-functional collaboration across organizational boundaries, including leading technical discussions.

Experience:10+ yearsSemiconductor manufacturingAnalogEmbedded systemsCMOSWafer fabrication

Education:Master's in Electrical Engineering; Electrical and Computer Engineering; semiconductor-focused discipline

Skills:CommunicationCross-functional collaborationTechnical leadershipProblem-solvingMentorship

Company Brief

Texas Instruments

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Dallas, United States

Founded: 1930

Website LinkedIn