Senior Packaging Engineer

Arago
Paris
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Communication","Problem-solving","Teamwork"]

Senior Packaging Engineer leading IC packaging initiatives from concept to manufacturing, establishing supply chain, managing sub-contractors, and overseeing NPI/ramp-up for Arago devices in a high-velocity, cross-functional hardware/photonic setting.

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FursaFursa
Arago
Arago
2 months ago

Senior Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Senior Packaging Engineer leading IC packaging initiatives from concept to manufacturing, establishing supply chain, managing sub-contractors, and overseeing NPI/ramp-up for Arago devices in a high-velocity, cross-functional hardware/photonic setting.
Location: Paris
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Design packaging solutions from initial drawings and simulations to DFM.
  • •Identify, vet, and manage external sub-contractors.
  • •Collaborate cross-functionally with IC design, optical, and PCB teams to align packaging specifications across domains.
  • •Lead the chip industrialization process, ensuring high yield and Cpk.
  • •Conduct thorough failure analysis and debugging.

Pay and Benefits

Perks:Health InsurancePensionEquityRelocationPaid Leave

Key Requirements

  • •Master's degree in Electrical Engineering or Integrated Circuits Design.
  • •5+ years of experience in the semiconductor and photonic packaging industry.
  • •Proficiency in heterogeneous integration and packaging processes (wafer dicing, high-density Cu pillars, flip-chip, 2.5D/3D, etc.).
  • •Strong expertise in photonic/optoelectronic packaging and micro-scale optical alignment (InP, GaAs, non-Si semiconductors).
  • •Proficiency in thermal, mechanical, and EM simulations; experience with Cadence Allegro, Altium, Cadence Virtuoso, Cadence Sigrity, ANSYS, HFSS, SIwave.
Experience:5+ yearsSemiconductorPhotonic packagingOptoelectronicsIC packaging
Education:Master's
Skills:CommunicationProblem-solvingTeamwork
Languages:EnglishFrench
Tech Stack:Cadence AllegroAltiumCadence VirtuosoCadence SigrityANSYS MechanicalHFSSSIwaveWafer dicing2.5D3DSoICInPGaAs

Company Brief

Arago
Develops energy-efficient photonic AI processors (codenamed “JEF”) that use light-based computation to drastically reduce energy consumption for AI workloads, targeting data centers and large-scale inference deployments.
Industry: Deep Tech
Company Size: Small (11 to 50 employees)
Growth: Early Stage Startup
Funding: Seed
Headquarters: Paris, France
Founded: 2024
Glassdoor
Glassdoor: 3.9
WebsiteGlassdoor