Arago

1 month ago

Senior Packaging Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Senior Packaging Engineer leading IC packaging initiatives from concept to manufacturing, establishing supply chain, managing sub-contractors, and overseeing NPI/ramp-up for Arago devices in a high-velocity, cross-functional hardware/photonic setting.

Location: Paris

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Design packaging solutions from initial drawings and simulations to DFM.
•Identify, vet, and manage external sub-contractors.
•Collaborate cross-functionally with IC design, optical, and PCB teams to align packaging specifications across domains.
•Lead the chip industrialization process, ensuring high yield and Cpk.
•Conduct thorough failure analysis and debugging.

Pay and Benefits

Perks:Health InsurancePensionEquityRelocationPaid Leave

Key Requirements

•Master's degree in Electrical Engineering or Integrated Circuits Design.
•5+ years of experience in the semiconductor and photonic packaging industry.
•Proficiency in heterogeneous integration and packaging processes (wafer dicing, high-density Cu pillars, flip-chip, 2.5D/3D, etc.).
•Strong expertise in photonic/optoelectronic packaging and micro-scale optical alignment (InP, GaAs, non-Si semiconductors).
•Proficiency in thermal, mechanical, and EM simulations; experience with Cadence Allegro, Altium, Cadence Virtuoso, Cadence Sigrity, ANSYS, HFSS, SIwave.

Experience:5+ yearsSemiconductorPhotonic packagingOptoelectronicsIC packaging

Education:Master's

Skills:CommunicationProblem-solvingTeamwork

Languages:EnglishFrench

Tech Stack:Cadence AllegroAltiumCadence VirtuosoCadence SigrityANSYS MechanicalHFSSSIwaveWafer dicing2.5D3DSoICInPGaAs

Company Brief

Arago

Develops energy-efficient photonic AI processors (codenamed “JEF”) that use light-based computation to drastically reduce energy consumption for AI workloads, targeting data centers and large-scale inference deployments.

Industry: Deep Tech

Company Size: Small (11 to 50 employees)

Growth: Early Stage Startup

Funding: Seed

Headquarters: Paris, France

Founded: 2024

Glassdoor: 3.9

Website Glassdoor

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Arago

1 month ago

Senior Packaging Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Location: Paris

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Design packaging solutions from initial drawings and simulations to DFM.
•Identify, vet, and manage external sub-contractors.
•Collaborate cross-functionally with IC design, optical, and PCB teams to align packaging specifications across domains.
•Lead the chip industrialization process, ensuring high yield and Cpk.
•Conduct thorough failure analysis and debugging.

Pay and Benefits

Perks:Health InsurancePensionEquityRelocationPaid Leave

Key Requirements

•Master's degree in Electrical Engineering or Integrated Circuits Design.
•5+ years of experience in the semiconductor and photonic packaging industry.
•Proficiency in heterogeneous integration and packaging processes (wafer dicing, high-density Cu pillars, flip-chip, 2.5D/3D, etc.).
•Strong expertise in photonic/optoelectronic packaging and micro-scale optical alignment (InP, GaAs, non-Si semiconductors).
•Proficiency in thermal, mechanical, and EM simulations; experience with Cadence Allegro, Altium, Cadence Virtuoso, Cadence Sigrity, ANSYS, HFSS, SIwave.

Experience:5+ yearsSemiconductorPhotonic packagingOptoelectronicsIC packaging

Education:Master's

Skills:CommunicationProblem-solvingTeamwork

Languages:EnglishFrench

Tech Stack:Cadence AllegroAltiumCadence VirtuosoCadence SigrityANSYS MechanicalHFSSSIwaveWafer dicing2.5D3DSoICInPGaAs

Company Brief

Arago

Industry: Deep Tech

Company Size: Small (11 to 50 employees)

Growth: Early Stage Startup

Funding: Seed

Headquarters: Paris, France

Founded: 2024

Glassdoor: 3.9

Website Glassdoor