Process and Integration Engineer, Optoelectronics

Broadcom
Pennsylvania
Workplace: OnsiteFull timeUSD 109,700 - 175,500 annuallyFunction: Communications, PR & CommunityExperience: 6+ yearsEducation: mastersSkills: ["Written and verbal communication","Detail-oriented problem-solving","Proactive","Action-oriented mindset"]

Join the Optical Systems Division as a technical authority for facet coating and process integration in a 24/7 optoelectronics manufacturing environment. You’ll lead development and scaling of multilayer thin-film coatings using Ion Beam Sputtering, run DOE to improve yield and productivity, and own process control/quality systems (SPC, FMEA, CAPA). Partner with Product, Quality, and R&D, manage equipment lifecycle and upgrades, and report KPIs and process health to management.

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FursaFursa
Broadcom
Broadcom
1 month ago

Process and Integration Engineer, Optoelectronics

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Last checked: 2 days agoStatus: Live

Job Summary

Join the Optical Systems Division as a technical authority for facet coating and process integration in a 24/7 optoelectronics manufacturing environment. You’ll lead development and scaling of multilayer thin-film coatings using Ion Beam Sputtering, run DOE to improve yield and productivity, and own process control/quality systems (SPC, FMEA, CAPA). Partner with Product, Quality, and R&D, manage equipment lifecycle and upgrades, and report KPIs and process health to management.
Location: Pennsylvania
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop, optimize, and scale multilayer coating processes (AR, HR, passivation) using IBS, including DOE design and batch process optimization.
  • •Serve as technical lead for facet coating and backend operations such as wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).
  • •Own process control and quality systems including SPC, FMEA, OCAP, metrology workflows, root-cause analysis, and CAPA to address defects and excursions.
  • •Define requirements for new equipment and lead qualification/buyoff of engineering upgrades, including equipment lifecycle management.
  • •Partner with Product, Quality, and R&D teams and external foundries; manage subcontractor performance via remote monitoring and maintain SOPs and technical documentation.

Pay and Benefits

Salary: USD 109,700 - 175,500 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kEsppPaid Leave

Key Requirements

  • •Master’s degree in Materials Science or Optical, Chemical, or Electrical Engineering.
  • •6+ years of semiconductor manufacturing experience, including 4+ years hands-on thin-film deposition for optoelectronic devices.
  • •Solid understanding of vacuum physics and deposition techniques including Ion Beam Sputtering (IBS) and ALD.
  • •Strong background in statistical analysis with SPC, DOE, FMEA, DMAIC, and tools such as JMP, SQL, and Tableau.
  • •Experience with automated bar-handling, wafer scribing and cleaving, Pick-and-Place (PnP), Automated Visual Inspection (AVI), and Burn-in.
Experience:6+ yearsSemiconductor manufacturing
Education:Master's in Materials Science or Optical, Chemical, or Electrical Engineering
Skills:Written and verbal communicationDetail-oriented problem-solvingProactiveAction-oriented mindset
Tech Stack:Ion Beam Sputtering (IBS)ALDVacuum physicsMultilayer coatingsARHRPassivation layersSpectroscopic ellipsometrySpectrophotometryAFMSPCFMEAOCAPCAPADOEDMAICJMPSQLTableauAVI

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn