Senior Package Layout Engineer - Hardware

NVIDIA
Bengaluru
Workplace: HybridFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Creativity","Autonomy","Design collaboration","Problem-solving","Methodology development"]

Collaborate with a Technical Package Lead and design teams to create detailed IC substrate layouts for NVIDIA products. Implement high-speed, high-density ASIC package designs by developing substrate breakout patterns, optimizing package pinouts, and supporting routing, placement, stack-up, reference planes, and power distribution. Conduct feasibility studies across size, cost, and system performance, and use Cadence APD/SiP tools to build CAD libraries and improve layout productivity.

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FursaFursa
NVIDIA
NVIDIA
1 week ago

Senior Package Layout Engineer - Hardware

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live
Reposted: similar role first listed 7 months ago

Job Summary

Collaborate with a Technical Package Lead and design teams to create detailed IC substrate layouts for NVIDIA products. Implement high-speed, high-density ASIC package designs by developing substrate breakout patterns, optimizing package pinouts, and supporting routing, placement, stack-up, reference planes, and power distribution. Conduct feasibility studies across size, cost, and system performance, and use Cadence APD/SiP tools to build CAD libraries and improve layout productivity.
Location: Bengaluru
Workplace: Hybrid
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Collaborate as part of a Layout team to implement high-speed, high-density ASIC packages.
  • •Perform substrate breakout patterns and optimize package pinout assignments using system-level trade-offs.
  • •Help execute package routing, placement, stack-up, reference plane, and power distribution using Cadence APD or SiP tool suite.
  • •Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
  • •Conduct design feasibility studies and develop symbols/CAD library databases to improve layout productivity.

Key Requirements

  • •B.S. in Electrical Engineering or equivalent experience.
  • •5+ years of PCB layout experience for graphics cards, motherboards, line cards, or related technology; HDI experience is a plus.
  • •Proven experience in substrate layout for wire bond and flip chip packages, preferred.
  • •Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager).
  • •Strong high-speed design signal integrity practices; Virtuoso and Calibre are a plus; Valor is helpful.
Experience:5+ yearsHardwarePCB layoutASIC packaging
Education:Bachelor's in Electrical Engineering
Skills:CreativityAutonomyDesign collaborationProblem-solvingMethodology development
Tech Stack:Cadence APDSiPConstraint ManagerVirtuosoCalibreValorPCB layoutHDIWire bondFlip chipASICIC substratesHigh-speed designSignal integrity

Company Brief

NVIDIA
Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1993
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