1 day ago

Senior ASIC Package Design Automation and AI Engineer

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Support the package design organization by developing and deploying AI-driven automation workflows. Improve efficiency, quality, and scalability of package, bridge, and interposer design using automation and AI/ML methods for tasks like auto-routing, placement optimization, signal integrity, and power delivery. Partner with EDA tool teams and vendors to enhance tool capabilities, integrate design flows, extract/analyze data, and enable closed-loop optimization with simulation teams.

Location: Austin

Workplace: Hybrid

Employment Type: Full time

Job Function: Data Science & Machine Learning

Seniority: Mid level

Key Responsibilities

•Develop, deploy, and maintain automation frameworks and AI-assisted workflows for package substrates, silicon interposers, and bridge-based integration.
•Apply AI/ML methodologies to enhance key design activities such as auto-routing, placement optimization, signal integrity, power delivery, and design rule compliance/verification.
•Collaborate with the package design team to identify high-impact automation opportunities and reduce manual effort and cycle time.
•Partner with EDA tool teams and vendors to implement automation features and support advanced packaging design enablement.
•Develop tools for design-flow integration, data extraction/analysis, and closed-loop optimization with simulation teams, including supporting tape-outs and documentation for broader adoption.

Key Requirements

•Translate complex design challenges into scalable automation solutions.
•Work effectively across Design, EDA, and AI/ML teams.
•Operate with limited supervision to deliver high-quality results aligned to project goals.
•Experience in semiconductor packaging or SoC physical design automation.
•Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.

Experience:Semiconductor packagingSoC physical design automationEDAAI/ML

Education:Bachelor's

Skills:Problem-solvingOwnership mindsetCommunicationCollaborationIndependent execution

Languages:En-us

Tech Stack:PythonTclSKILLC++PyTorchTensorFlowCadence APDCadence SiPSiemens XpeditionSynopsys 3DIC CEDAAuto-routingPlacement optimizationDRCLVSParasitic extractionSIPIAI/ML

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD