AMD

2 weeks ago

Senior Staff Packaging Design Engineer

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Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Lead end-to-end SMTS package design execution for complex products, delivering performance, cost, quality, and schedule targets. Develop substrate layouts, bump maps, and interposer designs for advanced 2.5D/3D and chiplet-based architectures. Collaborate closely with SI/PI, mechanical, and SOC teams, plus OSATs and substrate suppliers, to drive design decisions and communicate risks. Define and improve packaging methodologies, and mentor junior engineers.

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Seniority: Mid level

Key Responsibilities

•Lead end-to-end package design execution for complex products to meet performance, cost, quality, and schedule targets.
•Handle multiple concurrent design programs in fast-paced, high-pressure environments.
•Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
•Collaborate with SI/PI, mechanical, SOC teams, OSATs, and substrate suppliers to deliver optimized solutions.
•Define and enhance packaging design methodologies, improve layout efficiency and standardization, and mentor junior engineers.

Pay and Benefits

Salary: SGD 112,700 - 161,000 annually

Key Requirements

•Minimum 8+ years of experience designing complex substrate designs, Silicon Bridges, or interposers.
•Hands-on experience with advanced packaging technologies including 2.5D/3D integration (interposers, chiplets).
•Experience using EDA tools such as Cadence SIP/APD and Synopsys 3DICC (or equivalent).
•Experience working with OSATs, foundries, and substrate vendors.
•Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, or a related field.

Experience:8+ yearsAdvanced packaging2.5D/3D integrationChipletsEDA tools

Education:Bachelor's in Electrical Engineering, Computer Engineering, or related field

Skills:OwnershipAccountabilityCollaborationCommunicationSelf-driven

Tech Stack:AI/MLAutomation2.5D3DChipletsInterposersSubtrate layoutsBump mapsCadence SIPCadence APDSynopsys 3DICCEDA toolsOSATsFoundries

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD