Principal Engineer, FE OCT CPEE ADT BOND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 7+ yearsSkills: ["Problem-solving","Communication","Collaboration","Project management","Data analysis"]

Lead the startup, development, optimization, and control of wafer-level bonding processes for Micron’s ADT program, including hybrid, fusion, and temporary bonding. Drive yield improvement, cost reduction, process capability (Cpk) enhancement, and risk management by resolving complex manufacturing challenges. Partner across process integration, equipment engineering, suppliers, and global sites to qualify new processes, improve reliability, and implement robust control plans and root-cause methods.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Principal Engineer, FE OCT CPEE ADT BOND

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Lead the startup, development, optimization, and control of wafer-level bonding processes for Micron’s ADT program, including hybrid, fusion, and temporary bonding. Drive yield improvement, cost reduction, process capability (Cpk) enhancement, and risk management by resolving complex manufacturing challenges. Partner across process integration, equipment engineering, suppliers, and global sites to qualify new processes, improve reliability, and implement robust control plans and root-cause methods.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop, qualify, and optimize wafer-level bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration).
  • •Improve yield and reliability by analyzing process/tool/material interactions and performing root-cause analysis using DOE, FMEA, 8D, and SPC.
  • •Collaborate with equipment engineering to qualify and optimize bonding tools and define specifications, roadmap, and process control strategies.
  • •Support technology transfer and ramp-up across global sites by aligning process baseline documentation and control plans.
  • •Diagnose and resolve manufacturing line issues affecting bonding yield and performance, including containment, recovery, and continuous improvement for cycle time and cost efficiency.

Key Requirements

  • •Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or a related field.
  • •7+ years of relevant experience in semiconductor manufacturing or advanced packaging.
  • •Strong knowledge of semiconductor bonding processes, including wafer-to-wafer hybrid bonding and fusion bonding (preferred).
  • •Experience with Cu plating, CMP interaction, surface preparation, and defect mechanisms.
  • •Proficiency in data analysis and statistical modeling (e.g., SPC), plus problem-solving using 8D, FMEA, and DOE.
Experience:7+ yearsSemiconductor manufacturingAdvanced packaging
Education:
Skills:Problem-solvingCommunicationCollaborationProject managementData analysis
Tech Stack:DOEFMEA8DSPCCpkInline monitoringControl plansPORFault isolationCu platingCMPHBMTSVEVGTELDisco

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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