Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Communication","Presentation","Teamwork","Analytical thinking","Project management"]

Identify, select, and evaluate new highly automated equipment and technologies to support current and future packaging technology needs. Lead equipment design/capability requirements aligned to the process and packaging roadmap, manage supplier benchmarking, and support installation, qualification, and handover to production. Maintain equipment maturity and capability constraints (EMI/TOR), enable equipment parameter monitoring and automation systems, and collaborate across cross-functional teams on continuous improvement projects.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Identify, select, and evaluate new highly automated equipment and technologies to support current and future packaging technology needs. Lead equipment design/capability requirements aligned to the process and packaging roadmap, manage supplier benchmarking, and support installation, qualification, and handover to production. Maintain equipment maturity and capability constraints (EMI/TOR), enable equipment parameter monitoring and automation systems, and collaborate across cross-functional teams on continuous improvement projects.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Identify, select, and evaluate new automated equipment and technologies for advantage packaging technology requirements.
  • •Define and develop new equipment design/capability requirements aligned to the process and packaging roadmap, including creative solutions for constraints and future needs.
  • •Plan capital requests, create and own purchasing specification documentation, establish qualification criteria/roadmap, and ensure handover to production.
  • •Maintain and update equipment maturity and constraint matrices (EMI and TOR) with inputs across assembly sites, translating process/material knowledge into equipment requirements.
  • •Enable equipment system readiness by supporting characterization, parameter monitoring, and equipment control systems (including FDC/APC/alarms) in coordination with IT & automation teams; support continuous improvement through supplier and production collaboration.
Travel: Low travel

Key Requirements

  • •PhD/Masters/bachelor’s degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics, or equivalent.
  • •Basic knowledge of semiconductor manufacturing assembly, wafer bumping, packaging technologies, and advanced packaging techniques.
  • •Experience/technical knowledge in assembly, wafer bumping, and/or advanced packaging technology (equipment automation experience is a plus).
  • •Strong communication and presentation skills (English speaking is required), with the ability to collaborate in cross-functional teams and with external vendors.
  • •Strong analytical and project management skills, with a growth mindset and interest in semiconductor industry work (internship/experience in semiconductors is a plus).
Experience:Semiconductor manufacturingAssemblyWafer bumpingAdvanced packagingSemiconductor industryEquipment automation
Skills:CommunicationPresentationTeamworkAnalytical thinkingProject management
Languages:English
Tech Stack:AI-assisted toolsFDCPCSE3APCIoTECMR2RAMHSDatamationTOREMIDoc2

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn