Hardware Engineering Technical Leader

Cisco
United States
Workplace: OnsiteFull timeUSD 191,400 - 281,400 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 12+ yearsEducation: bachelorsSkills: ["Verbal communication","Written communication","Cross-functional collaboration","Technical problem-solving"]

Lead technical ownership of optical transceiver assembly and wafer-level packaging processes for silicon photonics and coherent optics products. Drive high-volume, automated, cost-effective manufacturing process development and optimization using wafer-level bonding, Cu pillar, C3/C4 bumping, and TSV integration. Own DOE to improve yield, throughput, and operating windows, and serve as the in-house expert supporting technology transfer to manufacturing and contract manufacturers.

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FursaFursa
Cisco
Cisco
4 days ago

Hardware Engineering Technical Leader

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Source: Company careers pageValidated by: Fursa AI
Last checked: 23 hours agoStatus: Live

Job Summary

Lead technical ownership of optical transceiver assembly and wafer-level packaging processes for silicon photonics and coherent optics products. Drive high-volume, automated, cost-effective manufacturing process development and optimization using wafer-level bonding, Cu pillar, C3/C4 bumping, and TSV integration. Own DOE to improve yield, throughput, and operating windows, and serve as the in-house expert supporting technology transfer to manufacturing and contract manufacturers.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead technical ownership of optical transceiver assembly process development for silicon photonics packaging using advanced manufacturing technologies.
  • •Develop high-volume, highly automated, cost-effective manufacturing processes meeting performance, scalability, reliability, and cost objectives.
  • •Drive development and optimization of 2D/2.5D/3D wafer-level packaging processes including flip-chip wafer-level bonding, Cu pillar, C3/C4 bumping, and TSV integration.
  • •Design and implement DOE to optimize process capability, throughput, yield, and operating windows; lead technology transfer to manufacturing/contract manufacturers via documentation and operational handoff.
  • •Serve as the in-house technical expert for wafer-level packaging and mechanical assembly automation equipment, including software integration and electronic hardware interfaces.

Pay and Benefits

Salary: USD 191,400 - 281,400 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kPaid ParentalLong-term DisabilityBasic LifeEquity

Key Requirements

  • •Bachelor’s degree in Physics, Mechanical Engineering, Materials Science, or related field with 12+ years of experience (or Master’s + 8 years, or PhD + 5 years).
  • •8+ years of experience in back-end wafer processing, including materials characterization, failure analysis, IC packaging materials, and semiconductor packaging manufacturing processes.
  • •Experience managing overseas contract manufacturers and leading cross-functional teams to resolve manufacturing issues in high-volume production environments.
  • •Expertise in silicon photonics packaging knowledge (mechanical, thermal, optical, and RF design considerations).
  • •Knowledge of silicon photonics optoelectronic multi-chip module (OE-MCM) packaging design, development, and manufacturing.
Experience:12+ yearsCoherent opticsSilicon photonicsSemiconductor packagingManufacturingHigh-volume production
Education:Bachelor's in Physics, Mechanical Engineering, Materials Science, or related field
Skills:Verbal communicationWritten communicationCross-functional collaborationTechnical problem-solving
Tech Stack:Silicon photonicsSiPhPICPAM4Coherent optical transceiversDSPDesign of Experiments (DOE)2D/2.5D/3D wafer-level packagingFlip-chip wafer-level bondingCu pillar (CuP)C3/C4 bumpingThrough-Silicon Via (TSV)OE-MCMFree-space opticsFiber-optic assemblyMechanical assembly automation equipmentElectronic hardware interfaces

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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