TD Media and Collaterals Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 85,200 - 120,280 annuallyFunction: Product ManagementEducation: bachelorsSkills: ["Technical and analytical skills","Problem solving","Risk mitigation","Documentation"]

Develop and optimize assembly media and collaterals to improve quality, reliability, manufacturability, yield, and cost efficiency for Intel’s packaging technology roadmap. Design and implement new media/collateral solutions using DOE and SPC, evaluate them under simulated field conditions (e.g., heat, humidity, temperature cycling), and lead risk-mitigation initiatives. Provide technical consultation, and document improvements through research papers and presentations.

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Intel
Intel
10 hours ago

TD Media and Collaterals Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 10 hours agoStatus: Live
Reposted: similar role first listed 2 months ago

Job Summary

Develop and optimize assembly media and collaterals to improve quality, reliability, manufacturability, yield, and cost efficiency for Intel’s packaging technology roadmap. Design and implement new media/collateral solutions using DOE and SPC, evaluate them under simulated field conditions (e.g., heat, humidity, temperature cycling), and lead risk-mitigation initiatives. Provide technical consultation, and document improvements through research papers and presentations.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management

Key Responsibilities

  • •Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
  • •Design and implement new media and collateral solutions using DOE and SPC.
  • •Evaluate media and collaterals under simulated field conditions (heat, humidity, temperature cycling, dynamic forces).
  • •Identify and mitigate quality and reliability risks using innovative tools and methods.
  • •Consult on media and collateral challenges and document improvements via research papers and presentations.

Pay and Benefits

Salary: USD 85,200 - 120,280 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in mechanical engineering (or related) with 6 months of hands-on experience.
  • •Experience in Equipment Engineering, Mechanical Desing, and/or Process Engineering.
  • •Experience with mechanical design software such as SolidWorks or AutoCAD.
  • •Familiarity with semiconductor packaging processes and technology.
  • •Strong technical and analytical skills to deliver results on complex, time-critical projects.
Experience:Semiconductor packagingManufacturing
Education:Bachelor's in Mechanical engineering (or related field)
Skills:Technical and analytical skillsProblem solvingRisk mitigationDocumentation
Tech Stack:SolidWorksAutoCADDesign of Experiments (DOE)Statistical Process Control (SPC)

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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