Applied Materials

4 weeks ago

Director, Advanced Packaging Disruptive Technology (Based in Singapore)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Define and drive N+2 and beyond pathfinding strategy for advanced packaging technologies, shaping future integration architectures and unlocking new value. Lead a high-impact exploratory/pre-product innovation team focused on technologies such as D2W, RDL, CoWoS, and TSV. Translate customer roadmaps and market inflections into actionable technology strategies, build an ecosystem of partners, and govern early-stage programs while aligning teams to transition concepts into development pipelines.

Location: Singapore, Boise, Austin, Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Executive & General Management

Seniority: Director level

Key Responsibilities

•Define and execute a long-range (N+2 and beyond) advanced packaging pathfinding roadmap.
•Lead concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms.
•Evaluate emerging technology options and guide make/buy/partner decisions to build differentiated capabilities ahead of adoption cycles.
•Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.
•Build and govern early-stage technology programs and align engineering, product, and business units to transition concepts into development pipelines.

Travel: Medium travel

Key Requirements

•15+ years of experience in semiconductor technology, including advanced packaging and/or adjacent domains.
•Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
•Strong understanding of advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc.) with ability to think beyond existing paradigms.
•Proven experience building and leading cross-functional or exploratory R&D teams.
•Ability to translate complex technology concepts into business impact and strategic direction.

Experience:15+ yearsSemiconductorsAdvanced packagingR&DExploratory technologyHeterogeneous integrationChiplet ecosystems

Education:Master's in Materials Science, Electrical Engineering, Mechanical Engineering, Physics (or related field)

Skills:LeadershipInnovation strategyStrategic thinkingMentorshipDecision-making

Tech Stack:Advanced packagingD2WRDLCoWoSTSVHeterogeneous integrationChiplet ecosystemsAIHPCMemory integrationIntegration architectures

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

4 weeks ago

Director, Advanced Packaging Disruptive Technology (Based in Singapore)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Location: Singapore, Boise, Austin, Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Executive & General Management

Seniority: Director level

Key Responsibilities

•Define and execute a long-range (N+2 and beyond) advanced packaging pathfinding roadmap.
•Lead concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms.
•Evaluate emerging technology options and guide make/buy/partner decisions to build differentiated capabilities ahead of adoption cycles.
•Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.
•Build and govern early-stage technology programs and align engineering, product, and business units to transition concepts into development pipelines.

Travel: Medium travel

Key Requirements

•15+ years of experience in semiconductor technology, including advanced packaging and/or adjacent domains.
•Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
•Strong understanding of advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc.) with ability to think beyond existing paradigms.
•Proven experience building and leading cross-functional or exploratory R&D teams.
•Ability to translate complex technology concepts into business impact and strategic direction.

Experience:15+ yearsSemiconductorsAdvanced packagingR&DExploratory technologyHeterogeneous integrationChiplet ecosystems

Education:Master's in Materials Science, Electrical Engineering, Mechanical Engineering, Physics (or related field)

Skills:LeadershipInnovation strategyStrategic thinkingMentorshipDecision-making

Tech Stack:Advanced packagingD2WRDLCoWoSTSVHeterogeneous integrationChiplet ecosystemsAIHPCMemory integrationIntegration architectures

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor