Hardware Engineering Technical Leader

Cisco
Kaohsiung
Workplace: HybridFull timeFunction: Hardware, Embedded & Systems EngineeringEducation: bachelorsSkills: ["Cross-functional collaboration","Technical communication","Problem solving","Leadership"]

Lead technical development of silicon photonics packaging for next-generation coherent optical transceivers. Own optical transceiver assembly process development, design and optimize 2D/2.5D/3D wafer-level packaging (flip-chip bonding, Cu pillar, bumping, TSV integration), and use DOE to improve capability, throughput, yield, and operating windows. Partner with silicon photonics, product engineering, test, reliability, and manufacturing to transfer technologies into high-volume production and resolve prototyping and qualification challenges.

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Cisco
Cisco
1 day ago

Hardware Engineering Technical Leader

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Job Summary

Lead technical development of silicon photonics packaging for next-generation coherent optical transceivers. Own optical transceiver assembly process development, design and optimize 2D/2.5D/3D wafer-level packaging (flip-chip bonding, Cu pillar, bumping, TSV integration), and use DOE to improve capability, throughput, yield, and operating windows. Partner with silicon photonics, product engineering, test, reliability, and manufacturing to transfer technologies into high-volume production and resolve prototyping and qualification challenges.
Location: Kaohsiung
Workplace: Hybrid
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Provide technical ownership for optical transceiver assembly process development, focusing on silicon photonics packaging using advanced manufacturing technologies.
  • •Develop and optimize automated, high-volume, cost-effective manufacturing processes that meet performance, scalability, reliability, and cost objectives.
  • •Drive development and optimization of 2D/2.5D/3D wafer-level packaging processes, including flip-chip wafer-level bonding, Cu pillar, C3/C4 bumping, and TSV integration.
  • •Design and execute DOE to optimize process capability, throughput, yield, and operating windows, and lead technology transfer to manufacturing and contract manufacturers.
  • •Act as the in-house technical expert for wafer-level packaging and mechanical assembly automation equipment, including software integration and electronic hardware interfaces.

Key Requirements

  • •Bachelor’s degree in Physics, Mechanical Engineering, Materials Science, or related field with 15+ years of relevant experience (or Master’s with 10+ years, or Ph.D. with 8+ years).
  • •10+ years of experience in back-end wafer processing, including materials characterization, failure analysis, IC packaging materials, and semiconductor packaging manufacturing processes.
  • •Proven experience managing overseas contract manufacturers and leading cross-functional teams to resolve manufacturing issues in high-volume production.
  • •Technical knowledge of silicon photonics packaging, including mechanical, thermal, optical, and RF design considerations.
  • •Experience designing, developing, and manufacturing silicon photonics optoelectronic multi-chip module (OE-MCM) packaging.
Experience:Silicon photonicsSemiconductor packagingOptical communicationsHigh-volume manufacturing
Education:Bachelor's in Physics, Mechanical Engineering, Materials Science
Skills:Cross-functional collaborationTechnical communicationProblem solvingLeadership
Tech Stack:Silicon photonics (SiPh)PICCoherent optical transceiversPAM41.6T PAM4 DSP2D/2.5D/3D wafer-level packagingFlip-chip wafer-level bondingCu pillar (CuP)C3 bumpingC4 bumpingThrough-Silicon Via (TSV) integrationDesign of Experiments (DOE)Materials characterizationFailure analysisOptical transceiver assemblyMechanical assembly automationFree-space opticsFiber-optic assemblyWafer-level packagingMechanical

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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