Staff Engineer, Package Reliability

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Data Analytics & Business IntelligenceExperience: 10+ yearsEducation: bachelorsSkills: ["Self-motivated","Independent work","Detail oriented","Analytical problem-solving","Strong communication"]

Serve as a GQ Package Reliability Engineer, owning end-to-end package quality and reliability for Micron DRAM and HBM product lines. Coordinate package qualification for new products and changes in designs, materials, or processes, and provide phase-gate inputs and recommendations for release decisions. Develop reliability test plans, drive root-cause and corrective actions for package qualification and GCP failures, and ensure CTQ compliance with strong analytical reporting.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Staff Engineer, Package Reliability

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live

Job Summary

Serve as a GQ Package Reliability Engineer, owning end-to-end package quality and reliability for Micron DRAM and HBM product lines. Coordinate package qualification for new products and changes in designs, materials, or processes, and provide phase-gate inputs and recommendations for release decisions. Develop reliability test plans, drive root-cause and corrective actions for package qualification and GCP failures, and ensure CTQ compliance with strong analytical reporting.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Data Analytics & Business Intelligence
Seniority: Mid level

Key Responsibilities

  • •Own package quality and reliability for DRAM and HBM product lines end to end.
  • •Provide inputs/approval for phase gates, including HVM monitoring and dispositions, based on reliability test results.
  • •Coordinate package qualification efforts for new products and for changes in designs, materials, or processes.
  • •Devise reliability test plans to assess risk for excursions, conversions, and reliability/qualification issues.
  • •Lead root cause and corrective action efforts and prepare reports for critical issues, ensuring CTQ compliance and inline validation.

Key Requirements

  • •BS degree or equivalent qualification in Engineering (e.g., Electronics, Mechanical, Physics, Semiconductor, Materials) or a related field.
  • •Master’s degree in physics, statistics, or Engineering (Semiconductor, Electronics, Mechanical, Materials) or equivalent experience.
  • •At least 10 years of working experience in PWF, DCA and 3DS packaging, with direct HBM experience preferred.
  • •Detailed knowledge of semiconductor package assembly processes and challenges, especially for HBM and 3DS packages.
  • •Understanding of thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses and industry reliability test methods, acceleration models, and sampling statistics.
Experience:10+ yearsSemiconductorsMemoryHBM3DS packaging
Education:Bachelor's
Skills:Self-motivatedIndependent workDetail orientedAnalytical problem-solvingStrong communication
Tech Stack:MAMMESJMPTableau

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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