NVIDIA

1 week ago

Senior OSAT Manufacturing Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 minutes agoStatus: Live

Job Summary

Drive high-volume OSAT manufacturing development by bringing new products and technologies to production and improving yield, cycle time, and quality/reliability. Tackle manufacturing execution and quality issues with systemic solutions, manage supplier performance evaluation, and lead change control, non-conforming material disposition, and multi-sourcing qualifications. Use statistical analysis and data visualization to support enhanced decision making.

Location: Taiwan

Workplace: Hybrid

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Seniority: Mid level

Key Responsibilities

•Bring new products and technologies to high-volume manufacturing.
•Drive continuous improvement in manufacturing yield, cycle time, and product quality/reliability.
•Address manufacturing execution and quality issues through systemic solutions.
•Deliver datamation solutions to enhance decision making.
•Manage supplier performance evaluation and lead change control, qualification, non-conforming material disposition, and multi-sourcing implementation.

Key Requirements

•Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, or Chemical Engineering (or equivalent experience).
•5+ years of validated experience in Flip Chip semiconductor packaging design, process, and materials development, including advanced assembly technologies such as 2.5D/3D packaging (photonics packaging a plus).
•Thorough understanding of chip assembly equipment design, including materials, process, substrate/package design in chip assembly operations.
•Extensive project management and OSAT management experience.
•Strong statistical analysis skills including quality control, SPC, gage R&R, and DOE techniques.

Experience:5+ yearsSemiconductor packagingOSATManufacturingSupply chain

Education:Master's

Skills:CollaborativeWritten communicationOral communicationProject managementStatistical analysis

Tech Stack:Flip Chip2.5D packaging3D packagingPhotonics packagingSPCGage R&RDOEData visualizationDatamation

Company Brief

NVIDIA

Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor

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NVIDIA

1 week ago

Senior OSAT Manufacturing Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 minutes agoStatus: Live

Job Summary

Location: Taiwan

Workplace: Hybrid

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Seniority: Mid level

Key Responsibilities

•Bring new products and technologies to high-volume manufacturing.
•Drive continuous improvement in manufacturing yield, cycle time, and product quality/reliability.
•Address manufacturing execution and quality issues through systemic solutions.
•Deliver datamation solutions to enhance decision making.
•Manage supplier performance evaluation and lead change control, qualification, non-conforming material disposition, and multi-sourcing implementation.

Key Requirements

•Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, or Chemical Engineering (or equivalent experience).
•5+ years of validated experience in Flip Chip semiconductor packaging design, process, and materials development, including advanced assembly technologies such as 2.5D/3D packaging (photonics packaging a plus).
•Thorough understanding of chip assembly equipment design, including materials, process, substrate/package design in chip assembly operations.
•Extensive project management and OSAT management experience.
•Strong statistical analysis skills including quality control, SPC, gage R&R, and DOE techniques.

Experience:5+ yearsSemiconductor packagingOSATManufacturingSupply chain

Education:Master's

Skills:CollaborativeWritten communicationOral communicationProject managementStatistical analysis

Tech Stack:Flip Chip2.5D packaging3D packagingPhotonics packagingSPCGage R&RDOEData visualizationDatamation

Company Brief

NVIDIA

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor