OpenAI

1 month ago

Advanced Packaging Reliability Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 4 hours agoStatus: Live

Job Summary

Lead reliability engineering for advanced HPC packages used in high-performance AI systems. Apply thermo-mechanical modeling to optimize package design, material selection, and assembly; develop reliability test plans with external partners; identify failure mechanisms; perform root-cause analysis; and recommend corrective actions to ensure robustness from architecture through high-volume manufacturing.

Location: San Francisco

Workplace: Hybrid

Employment Type: Full time

Job Function: Data Analytics & Business Intelligence

Key Responsibilities

•Lead reliability test plans for advanced HPC packages, including risk identification, failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development
•Drive design optimization based on thermo-mechanical modeling to improve reliability, power integrity, thermal performance, mechanical robustness, and platform scalability
•Develop, validate, and apply package reliability models and lifetime-prediction methodologies for assembly, qualification, and product operating conditions
•Evaluate and recommend package architectures, materials, and assembly processes to maximize reliability and manufacturing robustness
•Predict electromigration lifetime of package interconnects under product-specific current, temperature, workload, duty-cycle, and PCB boundary conditions

Pay and Benefits

Salary: USD 266,000 - 445,000 annually

Equity and Bonus:Equity

Key Requirements

•8+ years of industry experience with semiconductor package reliability principles and failure mechanisms (electromigration, solder-joint fatigue, interfacial delamination, dielectric cracking, via failure, warpage, creep, stress relaxation, material degradation)
•In-depth knowledge of advanced packaging architectures (2.5D/3.5D, interposers, chiplets, large substrates, HBM, redistribution layers, package-level power delivery)
•Demonstrated experience leading package failure investigations, root-cause analysis, and implementing corrective actions
•Strong experience with thermal and mechanical finite-element modeling of packages (temperature distribution, warpage, stress, fatigue, interfacial reliability)
•Strong understanding of package-material behavior (CTE, elasticity, viscoelasticity, plasticity, creep, adhesion, fracture toughness, thermal conductivity)

Experience:SemiconductorHardwareAI hardwareHigh-performance computingPackaging

Education:PhD / Doctorate in Mechanical Engineering

Skills:CommunicationLeadershipCollaboration

Tech Stack:Finite-element modelingFEMThermo-mechanicalElectromigration2.5D3.5DHBMInterposersRedistribution layersSolder jointsPower deliveryThermal modeling

Company Brief

OpenAI

Develops and deploys advanced generative AI models (including ChatGPT and DALL·E) and AI infrastructure, providing APIs and consumer products to accelerate safe AGI for broad benefit.

Industry: AI & Machine Learning

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Scaleup

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: San Francisco, United States

Founded: 2015

Glassdoor: 4.4

Website LinkedIn Glassdoor

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OpenAI

1 month ago

Advanced Packaging Reliability Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 4 hours agoStatus: Live

Job Summary

Location: San Francisco

Workplace: Hybrid

Employment Type: Full time

Job Function: Data Analytics & Business Intelligence

Key Responsibilities

•Lead reliability test plans for advanced HPC packages, including risk identification, failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development
•Drive design optimization based on thermo-mechanical modeling to improve reliability, power integrity, thermal performance, mechanical robustness, and platform scalability
•Develop, validate, and apply package reliability models and lifetime-prediction methodologies for assembly, qualification, and product operating conditions
•Evaluate and recommend package architectures, materials, and assembly processes to maximize reliability and manufacturing robustness
•Predict electromigration lifetime of package interconnects under product-specific current, temperature, workload, duty-cycle, and PCB boundary conditions

Pay and Benefits

Salary: USD 266,000 - 445,000 annually

Equity and Bonus:Equity

Key Requirements

•8+ years of industry experience with semiconductor package reliability principles and failure mechanisms (electromigration, solder-joint fatigue, interfacial delamination, dielectric cracking, via failure, warpage, creep, stress relaxation, material degradation)
•In-depth knowledge of advanced packaging architectures (2.5D/3.5D, interposers, chiplets, large substrates, HBM, redistribution layers, package-level power delivery)
•Demonstrated experience leading package failure investigations, root-cause analysis, and implementing corrective actions
•Strong experience with thermal and mechanical finite-element modeling of packages (temperature distribution, warpage, stress, fatigue, interfacial reliability)
•Strong understanding of package-material behavior (CTE, elasticity, viscoelasticity, plasticity, creep, adhesion, fracture toughness, thermal conductivity)

Experience:SemiconductorHardwareAI hardwareHigh-performance computingPackaging

Education:PhD / Doctorate in Mechanical Engineering

Skills:CommunicationLeadershipCollaboration

Tech Stack:Finite-element modelingFEMThermo-mechanicalElectromigration2.5D3.5DHBMInterposersRedistribution layersSolder jointsPower deliveryThermal modeling

Company Brief

OpenAI

Develops and deploys advanced generative AI models (including ChatGPT and DALL·E) and AI infrastructure, providing APIs and consumer products to accelerate safe AGI for broad benefit.

Industry: AI & Machine Learning

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Scaleup

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: San Francisco, United States

Founded: 2015

Glassdoor: 4.4

Website LinkedIn Glassdoor