Principal Engineer – NAND Process Pathfinding – Dry Etch

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: phdSkills: ["Cooperative","Problem-solving","Autonomous","Communication","Presentation"]

Lead advanced NAND dry etch process pathfinding within an Advanced NAND R&D team. Explore and develop new plasma chemistries and dry etch technologies to meet structural, electrical, yield, and integration needs across future NAND nodes. Manage next-generation dry etch chambers and drive the process roadmap to program and yield targets, using data analytics, AI/ML, automation, and predictive modeling while partnering with process integration and thin film teams.

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Micron Technology
Micron Technology
4 weeks ago

Principal Engineer – NAND Process Pathfinding – Dry Etch

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Job Summary

Lead advanced NAND dry etch process pathfinding within an Advanced NAND R&D team. Explore and develop new plasma chemistries and dry etch technologies to meet structural, electrical, yield, and integration needs across future NAND nodes. Manage next-generation dry etch chambers and drive the process roadmap to program and yield targets, using data analytics, AI/ML, automation, and predictive modeling while partnering with process integration and thin film teams.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Manage new, high-performance dry etch chambers and lead the dry etch process roadmap to meet program and yield targets.
  • •Explore and develop advanced dry etch methods to satisfy structural, electrical, yield, and integration demands across the NAND roadmap.
  • •Develop plasma chemistries, dry etch process technologies, and equipment capabilities for future technology nodes.
  • •Apply advanced data analytics, AI/ML tools, and statistical methods to accelerate process learning and improve etch performance.
  • •Drive process pathfinding using automation, predictive modeling, and data-driven decision making across dry etch and related process domains.

Key Requirements

  • •Practical experience with ICP and/or CCP plasma etch technologies in semiconductor process development.
  • •Strong understanding of plasma-surface interactions, etch chemistry, profile control, and dry etch equipment fundamentals.
  • •Solid foundation in plasma physics, materials interactions, and semiconductor process integration.
  • •Experience developing and refining dry etch processes for advanced semiconductor technologies.
  • •Familiarity with statistical analysis, data analytics, and process optimization methodologies.
Experience:Semiconductor process developmentDry etchNANDProcess integrationThin films
Education:PhD / Doctorate
Skills:CooperativeProblem-solvingAutonomousCommunicationPresentation
Tech Stack:NANDDry etchICPCCPPlasma etchPlasma-surface interactionsPlasma physicsPlasma chemistriesProcess integrationWet etchCVDDiffusionMetalsLithographyCMPAI/MLData analyticsStatistical methodologiesAutomationPredictive modeling

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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