Hardware Engineer

Cisco
Bengaluru
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 6+ yearsEducation: mastersSkills: []

Develop high-complexity PCB and package designs within Cisco’s Hardware Engineering group, ensuring compliance with IEEE standards and manufacturability best practices. Execute multi-layer designs using technologies like HDI and fine pitch pin fields, resolve critical signal integrity and EMC issues with partner teams, and implement ECAD design methodologies and point tools to improve productivity. Collaborate with mechanical and manufacturing engineers, plus contract manufacturers and fabrication vendors, to bring designs from conception to fabrication.

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FursaFursa
Cisco
Cisco
1 day ago

Hardware Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live

Job Summary

Develop high-complexity PCB and package designs within Cisco’s Hardware Engineering group, ensuring compliance with IEEE standards and manufacturability best practices. Execute multi-layer designs using technologies like HDI and fine pitch pin fields, resolve critical signal integrity and EMC issues with partner teams, and implement ECAD design methodologies and point tools to improve productivity. Collaborate with mechanical and manufacturing engineers, plus contract manufacturers and fabrication vendors, to bring designs from conception to fabrication.
Location: Bengaluru
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Execute complex PCB and package designs involving multiple layers and advanced technologies such as HDI, fine pitch pin fields, and high IO counts.
  • •Drive resolution of critical issues by partnering with Signal Integrity (SI), Mechanical (MCAD), and Manufacturing Engineers.
  • •Champion and implement new ECAD design methodologies and point tools (csh, Allegro scripts) to improve tool performance and productivity.
  • •Apply Signal Integrity rules, EMC, safety, and DFM guidelines to ensure first-pass success.
  • •Participate in cross-functional meetings with contract manufacturers (CM) and fabrication vendors to incorporate feedback into designs.

Key Requirements

  • •Requires a BTech/MTech in EE/EC or a related field with 6+ years of experience in advanced technology PCB and package design.
  • •Proven ability to design high-complexity PCBs and packages using advanced technologies such as HDI and fine pitch.
  • •Strong hands-on experience with ECAD tools, specifically Cadence Allegro, and scripting (csh, Allegro scripts).
  • •Deep understanding of PCB and package construction, including fabrication/assembly processes and Gerber generation.
Experience:6+ years
Education:Master's in EE/EC
Tech Stack:PCBPkgIEEEHDIFine Pitch Pin FieldsHigh IOSignal Integrity (SI)ECADCadence AllegroCshAllegro scriptsEMCSafetyDFMDesign for ManufacturabilityMCADGerber generation

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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Glassdoor: 4.0
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