ENGINEER, PE GFX ATE

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 4+ yearsEducation: bachelorsSkills: ["Debugging","Root-cause analysis","Data analysis","Cross-functional collaboration","Communication"]

Own high-speed Automated Test Equipment (ATE) test engineering for graphics-class DRAM (GDDR) as products ramp into high-volume production. Develop, debug, validate, and optimize test programs and coverage; perform high-speed I/O characterization and margining; lead electrical/physical failure analysis to reduce DPM and quality escapes. Drive yield, scrap/RMA failure analysis, and cross-site alignment while exploring agentic AI to accelerate test development and root-cause work.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

ENGINEER, PE GFX ATE

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Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live

Job Summary

Own high-speed Automated Test Equipment (ATE) test engineering for graphics-class DRAM (GDDR) as products ramp into high-volume production. Develop, debug, validate, and optimize test programs and coverage; perform high-speed I/O characterization and margining; lead electrical/physical failure analysis to reduce DPM and quality escapes. Drive yield, scrap/RMA failure analysis, and cross-site alignment while exploring agentic AI to accelerate test development and root-cause work.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Ramp high-speed GDDR-class products into high-volume production on ATE (wafer/probe and package test) to meet yield, quality, and cost targets.
  • •Develop, debug, validate, and optimize high-speed test programs and test content; expand coverage and advance DFT strategy and methodology.
  • •Perform high-speed I/O characterization and margining, including data-eye and timing-margin analysis and AC timing extraction across corners.
  • •Lead failure analysis of electrical and physical fails to drive root cause to closure, reducing DPM and eliminating quality escapes.
  • •Own yield monitoring and improvement by analyzing probe, burn-in, and final-test parametric data; align results across sites and manage scrap/RMA failure analysis.

Key Requirements

  • •Degree in Electrical Engineering, Computer Engineering, Physics, or a related field, with ATE product/test engineering experience commensurate with a mid/senior level (typically 4+ years).
  • •Hands-on experience developing, debugging, and optimizing ATE test programs for high-speed devices.
  • •Strong high-speed I/O characterization background, including data-eye/timing-margin analysis, AC timing extraction, and parametric data interpretation.
  • •Demonstrated results improving yield and reducing DPM/quality escapes.
  • •Structured root-cause failure-analysis skills for electrical and physical fails, plus strong programming/scripting ability.
Experience:4+ years
Education:Bachelor's
Skills:DebuggingRoot-cause analysisData analysisCross-functional collaborationCommunication
Tech Stack:ATEDFTHigh-speed I/OAC timing extractionData-eye analysisAIAI-assisted codingAI/MLAgentic AI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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