Advanced Packaging Technology Development Process Integration Engineer

Enable Intel’s advanced packaging technology roadmap by integrating upcoming technology nodes and coordinating cross-functional work across process modules, device engineering, yield, and reliability teams. Drive defect and yield closure using data-driven root cause analysis, lead process development from concept through qualification, and support Process Readiness Initiative (PRI) and transfer readiness for smooth transitions to high-volume manufacturing. Contribute cost-effective value engineering and ensure successful knowledge transfer and process stability post-transfer.