Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

NVIDIA
Santa Clara
Workplace: HybridFull timeUSD 196,000 - 368,000 annuallyFunction: Manufacturing & Production OperationsExperience: 12+ yearsEducation: phdSkills: ["Cross-functional influence","Problem solving","Up-leveling discussions","Creative thinking"]

Define physical limits for power, thermal dissipation, and packaging, then close the gap with cross-domain co-design. Analyze packaging and power delivery constraints against roadmap demands, develop solutions spanning silicon features, firmware/hardware co-design, and DFX updates, and evaluate emerging packaging technologies. Drive system-to-manufacturing improvements in performance, performance-per-watt, and provisioning efficiency while ensuring products are manufacturable, testable, and reliable.

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FursaFursa
NVIDIA
NVIDIA
16 hours ago

Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Define physical limits for power, thermal dissipation, and packaging, then close the gap with cross-domain co-design. Analyze packaging and power delivery constraints against roadmap demands, develop solutions spanning silicon features, firmware/hardware co-design, and DFX updates, and evaluate emerging packaging technologies. Drive system-to-manufacturing improvements in performance, performance-per-watt, and provisioning efficiency while ensuring products are manufacturable, testable, and reliable.
Location: Santa Clara
Workplace: Hybrid
Employment Type: Full time
Job Function: Manufacturing & Production Operations
Seniority: Mid level

Key Responsibilities

  • •Gather and analyze packaging, power delivery, and thermal dissipation constraints against roadmap demands, predicting when they will reduce competitiveness.
  • •Develop cross-domain solutions spanning silicon features, packaging innovation, firmware and hardware co-design, and DFX updates to improve product performance and reliability.
  • •Assess emerging packaging technologies and evaluate trade-offs for voltage/frequency, noise, reliability, and testability.
  • •Drive system-manufacturing co-design to improve performance, performance-per-watt, and provisioning efficiency across power, thermal, and adjacent domains.

Pay and Benefits

Salary: USD 196,000 - 368,000 annually

Key Requirements

  • •BS/MS/PhD in EE, Physics, or CE (or equivalent experience).
  • •12+ years relevant experience.
  • •Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems.
  • •Proven ability to convert physical-limit trends into impact, measures, and solutions.
  • •Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations.
Experience:12+ years
Education:PhD / Doctorate in EE, Physics, CE
Skills:Cross-functional influenceProblem solvingUp-leveling discussionsCreative thinking
Tech Stack:AIFirmwareDFXHardware

Company Brief

NVIDIA
Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1993
Glassdoor
Glassdoor: 4.3
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