Process Engineer E4

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 147,000 - 202,500 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Communication","Problem-solving","Innovation","Teamwork","Independent work"]

Design and optimize manufacturing processes for display and semiconductor technologies, focusing on advanced semiconductor packaging. Collect and analyze process data, perform hardware characterization, troubleshoot engineering issues, and measure film properties. Create technical documentation and collaborate with vendors, suppliers, and cross-functional R&D teams to develop new modules in advanced packaging. Drive problem solving across logic, DRAM, and NAND and contribute to roadmaps in hybrid and fusion bonding.

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Applied Materials
Applied Materials
1 week ago

Process Engineer E4

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Design and optimize manufacturing processes for display and semiconductor technologies, focusing on advanced semiconductor packaging. Collect and analyze process data, perform hardware characterization, troubleshoot engineering issues, and measure film properties. Create technical documentation and collaborate with vendors, suppliers, and cross-functional R&D teams to develop new modules in advanced packaging. Drive problem solving across logic, DRAM, and NAND and contribute to roadmaps in hybrid and fusion bonding.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Design and optimize manufacturing processes for display and semiconductor manufacturing technologies.
  • •Collect and analyze data, perform hardware characterization, and troubleshoot engineering issues.
  • •Measure film properties and generate technical documentation.
  • •Collaborate with vendors and suppliers and help implement new technologies and products.
  • •Partner with global cross-functional R&D teams to develop new modules in advanced semiconductor packaging and resolve customer concerns.
Travel: Medium travel

Pay and Benefits

Salary: USD 147,000 - 202,500 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVisionRemote WorkLearning Budget

Key Requirements

  • •Minimum BS/MS in Electrical, Mechanical Engineering, Material Engineering, or equivalent.
  • •5 years of experience in advanced packaging specializing in logic, DRAM, or NAND.
  • •Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics, and multi-wafer stacking.
  • •Strong communication skills for business units, cross-functional teams, and internal/external customers.
  • •Ability to lead projects in a fast-paced environment; self-starter who can work independently with minimal supervision.
Education:Bachelor's in Electrical, Mechanical Engineering, Material Engineering
Skills:CommunicationProblem-solvingInnovationTeamworkIndependent work
Tech Stack:MESW2W/D2W bondingMicro bumpsTSVThermal managementOpticsMulti-wafer stackingHybrid bondingFusion bonding

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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