Packaging Thermal Technologist

AMD
Austin
Workplace: OnsiteFull timeUSD 127,190 - 218,040 annuallyFunction: Research & Scientific (R&D)Education: mastersSkills: ["Communication","Technical leadership","Autonomy","Cross-functional collaboration"]

Own package-centric thermal modeling and multi-physics analysis to guide next-generation SoC/package/board architecture decisions. Build, validate, and apply thermal models to support System-Technology Co-Optimization (STCO), including electro-thermal and electro-optical integration across package, board, and cooling solutions. Partner with internal/external labs, influence technology readiness and roadmaps, and act as a thermal subject-matter expert for data center platforms.

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FursaFursa
AMD
AMD
1 day ago

Packaging Thermal Technologist

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Source: Company careers pageValidated by: Fursa AI
Last checked: 8 hours agoStatus: Live

Job Summary

Own package-centric thermal modeling and multi-physics analysis to guide next-generation SoC/package/board architecture decisions. Build, validate, and apply thermal models to support System-Technology Co-Optimization (STCO), including electro-thermal and electro-optical integration across package, board, and cooling solutions. Partner with internal/external labs, influence technology readiness and roadmaps, and act as a thermal subject-matter expert for data center platforms.
Location: Austin
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)

Key Responsibilities

  • •Define and drive next-generation package-platform architectures using rigorous, model-based decision making and System-Technology Co-Optimization (STCO).
  • •Develop, validate, and apply thermal models to guide SoC/package/board-level architecture and technology selection/integration.
  • •Partner with internal and external labs to establish validation strategies and experimental grounding for STCO-driven decisions.
  • •Align material properties, process capabilities, and modeling assumptions with architecture and STCO needs through collaboration with suppliers and component vendors.
  • •Serve as a thermal subject-matter expert for SoC, package, and system-level architectures with emphasis on data center platforms.

Pay and Benefits

Salary: USD 127,190 - 218,040 annually

Key Requirements

  • •MS or PhD in relevant engineering disciplines or physics.
  • •Demonstrated experience driving model-based architecture and design decisions using SoC/package/system-level thermal modeling and validation.
  • •Strong first-principles understanding of thermal modeling and CFD with multi-physics trade-offs across SoC, package, and system design/assembly.
  • •Experience with advanced PCB technologies, including materials, designs, and assembly constraints.
  • •Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
Experience:Data centerHigh-performance computingMulti-physicsCFDThermal modelingSTCO
Education:Master's
Skills:CommunicationTechnical leadershipAutonomyCross-functional collaboration
Languages:En-us
Tech Stack:Thermal modelingCFDMulti-physicsThermo-mechanicalElectro-thermalElectro-opticalPCBSMTSTCOElectro-optics

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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