Metal Packaging Process Support Engineer

Applied Materials
South Korea
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3-10 yearsEducation: mastersSkills: ["Ownership","Attention to detail","Communication","Interpersonal skills"]

Provide high-visibility technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments. You will support on-site installation, qualification, troubleshooting, and long-term process stabilization, while optimizing and maintaining PVD/EP processes. Execute process experiments and DOEs, analyze results with statistical methods, and perform structured root-cause analysis to resolve complex equipment and product issues. Collaborate with customers, field teams, and internal R&D to deliver practical process improvements.

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FursaFursa
Applied Materials
Applied Materials
2 months ago

Metal Packaging Process Support Engineer

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Job Summary

Provide high-visibility technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments. You will support on-site installation, qualification, troubleshooting, and long-term process stabilization, while optimizing and maintaining PVD/EP processes. Execute process experiments and DOEs, analyze results with statistical methods, and perform structured root-cause analysis to resolve complex equipment and product issues. Collaborate with customers, field teams, and internal R&D to deliver practical process improvements.
Location: South Korea
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Provide on-site technical support for Applied Materials PVD systems, including installation, qualification, troubleshooting, and long-term process stabilization.
  • •Support, maintain, and optimize PVD/EP processes for advanced and metal-package applications.
  • •Design and execute process experiments and DOEs, analyze results using statistical methods, and produce clear technical reports.
  • •Diagnose and resolve complex process and equipment issues using structured root cause analysis.
  • •Collaborate with customers, field teams, and internal engineering groups to achieve technical and operational objectives.
Travel: Medium travel

Key Requirements

  • •Master’s or Bachelor’s degree in Materials Science, Chemistry, Semiconductor Engineering, or a related technical discipline.
  • •3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging environments.
  • •Hands-on capability supporting process/equipment issues, including root cause analysis and structured troubleshooting in fab environments.
  • •Excellent communication and interpersonal skills for customer-facing technical support.
  • •Ability to work in physically demanding fab environments with strong ownership and attention to detail.
Experience:3-10 yearsSemiconductorsSemiconductor packagingAdvanced packagingFab operationsEquipment supportProcess engineering
Education:Master's
Skills:OwnershipAttention to detailCommunicationInterpersonal skills
Languages:English
Tech Stack:Physical Vapor Deposition (PVD)Electro Plating (EP)Chemical Vapor Deposition (CVD)Atomic Layer Deposition (ALD)Plasma Reactive Ion Etch (RIE)AnnealImplantEndura / Charger platformsNokota / Raider platforms

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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