Applied Materials

1 month ago

Metal Packaging Process Support Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Provide high-visibility technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments. You will support on-site installation, qualification, troubleshooting, and long-term process stabilization, while optimizing and maintaining PVD/EP processes. Execute process experiments and DOEs, analyze results with statistical methods, and perform structured root-cause analysis to resolve complex equipment and product issues. Collaborate with customers, field teams, and internal R&D to deliver practical process improvements.

Location: South Korea

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Provide on-site technical support for Applied Materials PVD systems, including installation, qualification, troubleshooting, and long-term process stabilization.
•Support, maintain, and optimize PVD/EP processes for advanced and metal-package applications.
•Design and execute process experiments and DOEs, analyze results using statistical methods, and produce clear technical reports.
•Diagnose and resolve complex process and equipment issues using structured root cause analysis.
•Collaborate with customers, field teams, and internal engineering groups to achieve technical and operational objectives.

Travel: Medium travel

Key Requirements

•Master’s or Bachelor’s degree in Materials Science, Chemistry, Semiconductor Engineering, or a related technical discipline.
•3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging environments.
•Hands-on capability supporting process/equipment issues, including root cause analysis and structured troubleshooting in fab environments.
•Excellent communication and interpersonal skills for customer-facing technical support.
•Ability to work in physically demanding fab environments with strong ownership and attention to detail.

Experience:3-10 yearsSemiconductorsSemiconductor packagingAdvanced packagingFab operationsEquipment supportProcess engineering

Education:Master's

Skills:OwnershipAttention to detailCommunicationInterpersonal skills

Languages:English

Tech Stack:Physical Vapor Deposition (PVD)Electro Plating (EP)Chemical Vapor Deposition (CVD)Atomic Layer Deposition (ALD)Plasma Reactive Ion Etch (RIE)AnnealImplantEndura / Charger platformsNokota / Raider platforms

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

Loading job details...

Preparing the role view and application actions.

Applied Materials

1 month ago

Metal Packaging Process Support Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Location: South Korea

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Provide on-site technical support for Applied Materials PVD systems, including installation, qualification, troubleshooting, and long-term process stabilization.
•Support, maintain, and optimize PVD/EP processes for advanced and metal-package applications.
•Design and execute process experiments and DOEs, analyze results using statistical methods, and produce clear technical reports.
•Diagnose and resolve complex process and equipment issues using structured root cause analysis.
•Collaborate with customers, field teams, and internal engineering groups to achieve technical and operational objectives.

Travel: Medium travel

Key Requirements

•Master’s or Bachelor’s degree in Materials Science, Chemistry, Semiconductor Engineering, or a related technical discipline.
•3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging environments.
•Hands-on capability supporting process/equipment issues, including root cause analysis and structured troubleshooting in fab environments.
•Excellent communication and interpersonal skills for customer-facing technical support.
•Ability to work in physically demanding fab environments with strong ownership and attention to detail.

Experience:3-10 yearsSemiconductorsSemiconductor packagingAdvanced packagingFab operationsEquipment supportProcess engineering

Education:Master's

Skills:OwnershipAttention to detailCommunicationInterpersonal skills

Languages:English

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor