Technology Development Process Engineer (Hybrid Bonding & Advanced Packaging)

Applied Materials
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsSkills: ["Data-driven problem solving","Process characterization","Cross-functional collaboration","Root-cause analysis","Technical documentation"]

Lead the development and integration of Hybrid Bonding advanced packaging technologies for Logic, Memory, and 3D heterogeneous integration. Own end-to-end process development and optimization, including characterization and DOE studies to define process windows and improve yield, alignment, electrical performance, and reliability. Investigate integration challenges using data-driven root-cause analysis and advanced metrology, and produce technical documentation, reports, patents, and technology roadmaps.

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Applied Materials
Applied Materials
4 days ago

Technology Development Process Engineer (Hybrid Bonding & Advanced Packaging)

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Last checked: 2 days agoStatus: Live

Job Summary

Lead the development and integration of Hybrid Bonding advanced packaging technologies for Logic, Memory, and 3D heterogeneous integration. Own end-to-end process development and optimization, including characterization and DOE studies to define process windows and improve yield, alignment, electrical performance, and reliability. Investigate integration challenges using data-driven root-cause analysis and advanced metrology, and produce technical documentation, reports, patents, and technology roadmaps.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize end-to-end Hybrid Bonding processes to meet bonding yield, alignment, electrical performance, and reliability targets.
  • •Design and execute process characterization and DOE studies to establish process windows and improve key metrics (e.g., bond strength, void density, overlay accuracy, oxidation control, interface quality).
  • •Investigate and resolve process integration challenges via data-driven root cause analysis across contamination, thermal budget, topography, warpage, and defectivity.
  • •Collaborate with equipment, materials, metrology, and integration teams to develop scalable die-to-wafer Hybrid Bonding solutions for HBM, Logic, and 3D heterogeneous integration technologies.
  • •Define characterization methodologies and create technical outputs including reports, patents, publications, and technology roadmaps.

Key Requirements

  • •Bachelor's, Master's, or PhD in Engineering, Materials Science, Physics, or a related discipline.
  • •Minimum 5 years of semiconductor experience in technology development, process integration, or advanced packaging.
  • •Hands-on experience with one or more of: Advanced Packaging, Hybrid Bonding, CMP, Plasma Processing, Wet Cleaning, TSV Integration, or Process Integration.
  • •Strong understanding of Hybrid Bonding mechanisms and package integration flows.
  • •Experience with reliability/failure analysis and advanced metrology techniques.
Experience:5+ yearsSemiconductorsAdvanced packagingProcess integrationHybrid bonding
Education:
Skills:Data-driven problem solvingProcess characterizationCross-functional collaborationRoot-cause analysisTechnical documentation
Tech Stack:Hybrid BondingAdvanced PackagingCMPPlasma processingWet cleaningCu-Cu direct bondingDielectric-to-dielectric bondingPost-bond annealingHBMLogicTSVRDLDie-to-wafer (D2W) bondingDOEJMPMinitabOptical inspectionIR imagingSEMAFM

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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