Packaging Module Development Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 115,110 - 219,550 annuallyFunction: Product ManagementExperience: 4+ yearsEducation: bachelorsSkills: ["Self-driven","Collaboration","Communication","Presentation","Problem-solving"]

Develop and optimize assembly materials, processes, and equipment to advance Intel’s semiconductor packaging roadmap. Use experimental design and statistical analysis to create process/equipment specifications, materials targets, and reliability requirements. Improve manufacturing efficiency and yield while meeting strict quality and reliability needs, collaborating with cross-functional teams, supplier quality, and external vendors to deliver qualification and standardization across packaging technologies.

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Intel
Intel
1 day ago

Packaging Module Development Engineer

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live
Reposted: similar role first listed 5 months ago

Job Summary

Develop and optimize assembly materials, processes, and equipment to advance Intel’s semiconductor packaging roadmap. Use experimental design and statistical analysis to create process/equipment specifications, materials targets, and reliability requirements. Improve manufacturing efficiency and yield while meeting strict quality and reliability needs, collaborating with cross-functional teams, supplier quality, and external vendors to deliver qualification and standardization across packaging technologies.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Develop assembly materials, processes, and/or equipment and apply novel concepts for innovative solutions in advanced packaging.
  • •Optimize manufacturing efficiency by developing innovative materials and processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • •Develop process and equipment specifications using DOE and data analysis, and document improvements through white papers.
  • •Develop materials target specifications and define materials specifications for contract assemblers and raw material vendors, interfacing with supplier quality and procurement teams.
  • •Set reliability requirements, consult on packaging problems, and lead continuous improvement using experimental design and statistical methods.

Pay and Benefits

Salary: USD 115,110 - 219,550 annually
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •Bachelor’s degree with 4+ years of experience, or Master’s degree with 3+ years, or Ph.D. in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, or Mechanical Engineering.
  • •4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.
  • •Experience collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.
  • •Proficiency in Design of Experiments (DOE) and statistical data analysis tools.
  • •Knowledge of reliability and quality requirements for semiconductor packaging and materials characterization techniques.
Experience:4+ yearsSemiconductor packaging
Education:Bachelor's in Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering (or related discipline)
Skills:Self-drivenCollaborationCommunicationPresentationProblem-solving

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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