Mechanical Engineer

Applied Materials
Bengaluru
Workplace: OnsiteFull timeFunction: Field Service, Maintenance & Skilled TradesExperience: 8-12 yearsEducation: bachelorsSkills: ["Communication","Cross-functional collaboration","Leading design reviews"]

Design and develop mechanical systems for semiconductor robotics and wafer-handling toolsets. Own mechanical packaging, robot mounting structures, load port/enclosure designs, docking and auto-levelling mechanisms, and wafer-environment airflow enclosures. Use FEA and GD&T to close design gaps, build and debug prototypes, and qualify throughput through deployment. Drive DFM/DFA, BOM ownership, and supplier/long-lead procurement across cross-functional teams.

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Applied Materials
Applied Materials
3 days ago

Mechanical Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Design and develop mechanical systems for semiconductor robotics and wafer-handling toolsets. Own mechanical packaging, robot mounting structures, load port/enclosure designs, docking and auto-levelling mechanisms, and wafer-environment airflow enclosures. Use FEA and GD&T to close design gaps, build and debug prototypes, and qualify throughput through deployment. Drive DFM/DFA, BOM ownership, and supplier/long-lead procurement across cross-functional teams.
Location: Bengaluru
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades
Seniority: Mid level

Key Responsibilities

  • •Define and own the mechanical package, including robot mounting structure, FOUP load port and enclosure design, and mobile platform integration.
  • •Select robots and end-effectors; run kinematics and payload studies; resolve hand-off requirements with the tool team.
  • •Develop docking and auto-levelling mechanisms, including vibration control through the docking sequence.
  • •Engineer wafer-handling environment enclosures and cleanliness-compliant structures; run and close FEA design gaps.
  • •Own CAD/Drawing release and DFM/DFA, lead prototype build/assembly/debug, qualify docking/levelling and deployment readiness, and support supplier selection and long-lead procurement.
Travel: Low travel

Key Requirements

  • •Hands-on industrial robot integration experience, including kinematics, reach/payload studies, and end-effector/automation cell design.
  • •Strong understanding of AGV chassis integration (drive, navigation, battery and charging) and wafer-handling cleanliness requirements.
  • •Ability to run structural, modal, vibration, and thermal FEA and use results to close design gaps before build release.
  • •Experience with ASME Y14.5 GD&T and tolerance stack-up analysis, plus ownership of large-assembly CAD and drawing release.
  • •B.E./B.Tech or M.E./M.Tech in Mechanical or Mechatronics Engineering with 8–12 years in semiconductor capital equipment, robotics, or factory automation.
Experience:8-12 yearsSemiconductor capital equipmentRoboticsFactory automation
Education:Bachelor's
Skills:CommunicationCross-functional collaborationLeading design reviews
Tech Stack:FEAASME Y14.5GD&TNXInventorSolidWorksPDMPLM

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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