Staff Equipment Development Engineer - Advanced Packaging

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Education: mastersSkills: ["Problem-solving","Collaboration","Root-cause thinking","Commitment"]

Develop and optimize first-of-a-kind wafer and die processing equipment in Micron’s Advanced Technology Packaging Development (APTD) team. Drive equipment maturity and 5+ year hardware roadmaps, improve cost, availability, and process capability, and collaborate with process development, manufacturing, and OEM vendors. Use failure analysis methods (FMEA, 8D, FDC/data science) to diagnose root causes and lead equipment transfer to production facilities, with some domestic or international travel.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
1 month ago

Staff Equipment Development Engineer - Advanced Packaging

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Develop and optimize first-of-a-kind wafer and die processing equipment in Micron’s Advanced Technology Packaging Development (APTD) team. Drive equipment maturity and 5+ year hardware roadmaps, improve cost, availability, and process capability, and collaborate with process development, manufacturing, and OEM vendors. Use failure analysis methods (FMEA, 8D, FDC/data science) to diagnose root causes and lead equipment transfer to production facilities, with some domestic or international travel.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Develop strategies to improve equipment maturity for FOAK hardware and maintain post probe wafer and die processing roadmaps.
  • •Develop and optimize wafer and assembly equipment to meet Micron product physical and electrical requirements.
  • •Optimize equipment to reduce cost, increase availability, and improve hardware and process capability.
  • •Perform root cause and failure mode analysis and drive APTD development projects with OEM and equipment vendors.
  • •Support equipment transfer to production facilities and conduct fundamental research to enable next-generation equipment products.
Travel: Low travel

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Master’s degree (or equivalent experience) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or a related technical field.
  • •2+ years of semiconductor process or equipment engineering experience.
  • •Fundamental understanding of post probe and assembly process and equipment interactions, including related inline/electrical/probe failure.
  • •2+ years of experience using DOE, Statistical Process Control (SPC), defect analysis, and data analysis.
  • •Ability to resolve sophisticated issues using root-cause or model-based problem solving while meeting commitments.
Experience:SemiconductorAdvanced packaging
Education:Master's
Skills:Problem-solvingCollaborationRoot-cause thinkingCommitment
Tech Stack:FMEA8DFDCData scienceDOESPCFailure analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn