New College Grad - HBM Product Development Failure Analysis Engineer

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Analytical skills","Collaboration","Data-driven problem solving","Effective communication"]

Join the Product Development Failure Analysis (PDFA) team to support new High Bandwidth Memory (HBM) product introductions. You’ll perform electrical, physical, and statistical failure analysis to uncover component failure mechanisms, analyze characterization and manufacturing data to identify root causes, and partner with Product, Process, Quality, and Test Engineering to improve yield and reliability. Use Python, AI-enabled tools, and statistical methods to evaluate large datasets, identify trends, and communicate corrective actions and risks for qualification and production ramp.

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Micron Technology
Micron Technology
1 week ago

New College Grad - HBM Product Development Failure Analysis Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 57 minutes agoStatus: Live

Job Summary

Join the Product Development Failure Analysis (PDFA) team to support new High Bandwidth Memory (HBM) product introductions. You’ll perform electrical, physical, and statistical failure analysis to uncover component failure mechanisms, analyze characterization and manufacturing data to identify root causes, and partner with Product, Process, Quality, and Test Engineering to improve yield and reliability. Use Python, AI-enabled tools, and statistical methods to evaluate large datasets, identify trends, and communicate corrective actions and risks for qualification and production ramp.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
  • •Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
  • •Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
  • •Use AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
  • •Communicate findings, corrective actions, and risk assessments to multi-functional partners to support product qualification and production ramp.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s degree in Electrical Engineering, Computer Science, Physics, Materials Science, or related field (or equivalent experience).
  • •Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
  • •Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
  • •Experience using Python or similar programming languages for data analysis and engineering applications.
  • •Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.
Experience:SemiconductorsSemiconductor manufacturingFailure analysisYield enhancementReliability engineering
Education:Bachelor's
Skills:Analytical skillsCollaborationData-driven problem solvingEffective communication
Tech Stack:PythonAIMachine learningStatistical softwareVLSI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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