Senior/Principal Eng, FE OCT CPEE PHOTO METROLOGY

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5-8 yearsSkills: ["Data-driven problem-solving","Communication","Cross-functional collaboration","Root-cause analysis","Supplier collaboration"]

Lead HVM photo/overlay metrology initiatives to improve yield, quality, productivity, and cost across semiconductor fabs. Diagnose complex metrology issues via data-driven root-cause analysis and define/deploy Best Known Methods across tools, nodes, and NPI/HVM programs. Serve as a technical point of contact for cross-fab overlay concerns, support MOR–POR gap closure, and collaborate with global teams and suppliers, including representing OCT in governance reviews.

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FursaFursa
Micron Technology
Micron Technology
3 days ago

Senior/Principal Eng, FE OCT CPEE PHOTO METROLOGY

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Job Summary

Lead HVM photo/overlay metrology initiatives to improve yield, quality, productivity, and cost across semiconductor fabs. Diagnose complex metrology issues via data-driven root-cause analysis and define/deploy Best Known Methods across tools, nodes, and NPI/HVM programs. Serve as a technical point of contact for cross-fab overlay concerns, support MOR–POR gap closure, and collaborate with global teams and suppliers, including representing OCT in governance reviews.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering

Key Responsibilities

  • •Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives.
  • •Resolve complex photo/overlay metrology issues using data-driven root-cause analysis.
  • •Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI.
  • •Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns.
  • •Drive MOR–POR gap closure and cross-fab/node alignment in collaboration with internal teams and suppliers.
Travel: Medium travel

Key Requirements

  • •BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or a related field.
  • •5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing.
  • •Hands-on experience in photo/overlay metrology engineering, including yield, quality, productivity, and cost improvement.
  • •Experience solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching.
  • •Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs, with strong data-driven communication skills.
Experience:5-8 yearsSemiconductor manufacturingNPIHVMPhotolithography
Skills:Data-driven problem-solvingCommunicationCross-functional collaborationRoot-cause analysisSupplier collaboration
Tech Stack:Photo/overlay metrologyMetrologyAI-assisted toolsBest Known Methods (BKM)HVMNPIMOR–POR

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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