Packaging Module Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Product ManagementEducation: phdSkills: ["Collaboration","Intellectual curiosity","Adaptability","Communication","Problem-solving"]

Develop and qualify advanced semiconductor packaging processes, materials, and equipment for high-volume manufacturing. Create process specifications and prototype workflows for emerging technologies, using DOE and statistical process control to analyze process windows and interactions. Drive continuous improvements to reliability, yield, quality, and productivity, while collaborating with design, materials, and manufacturing teams. Support equipment performance and sustainability through documentation, technical reporting, and standardization efforts.

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Intel
Intel
11 hours ago

Packaging Module Development Engineer

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Last checked: 11 hours agoStatus: Live

Job Summary

Develop and qualify advanced semiconductor packaging processes, materials, and equipment for high-volume manufacturing. Create process specifications and prototype workflows for emerging technologies, using DOE and statistical process control to analyze process windows and interactions. Drive continuous improvements to reliability, yield, quality, and productivity, while collaborating with design, materials, and manufacturing teams. Support equipment performance and sustainability through documentation, technical reporting, and standardization efforts.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Entry level

Key Responsibilities

  • •Develop and qualify advanced packaging processes, materials, and equipment to meet reliability, yield, and cost targets.
  • •Design process specifications, prototype workflows, and equipment configurations for emerging packaging technologies.
  • •Run DOE to analyze process windows and interactions between materials, equipment, and chemistry.
  • •Drive continuous process improvements to enhance capability, stability, quality, and productivity.
  • •Collaborate cross-functionally and document results through technical reports and papers, supporting standardization and sustaining performance.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •PhD in a relevant STEM field.
  • •6+ months of experience with Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
  • •Experience in packaging process development and equipment qualification.
  • •Ability to analyze process data, identify variations, and implement improvements.
  • •Solid knowledge of equipment setup, calibration, and performance evaluation in manufacturing environments.
Education:PhD / Doctorate
Skills:CollaborationIntellectual curiosityAdaptabilityCommunicationProblem-solving
Tech Stack:Design of Experiments (DOE)Statistical Process Control (SPC)

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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