MTB PWF DEBOND Equipment Engineer
Taiwan
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Experience: 3+ yearsEducation: bachelorsSkills: ["Process improvement","Root cause analysis","Continuous improvement"]Install, maintain, and sustain Debond equipment for semiconductor manufacturing, and provide backup coverage for Bond-area equipment. Establish and improve process conditions and technology, upgrade tool capabilities, and enhance product quality. Set process parameters, evaluate and plan new equipment/materials, and drive abnormal analysis and continuous improvement projects. You’ll also manage process parameters and process management initiatives within the Assembly & Test department.
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