Advanced Package Integration Engineer — Server Products

AMD
Austin
Workplace: HybridFull timeUSD 127,190 - 218,040 annuallyFunction: Hospitality & Food ServiceSkills: ["Problem-solving","Project management","Written communication","Verbal communication","Risk management"]

Drive package process development and product NPI for AMD EPYC server products. Own package planning, development, qualification, and execution planning across internal cross-functional teams and external suppliers. Lead global teams designing test vehicles and packages, identify technical and schedule risks, troubleshoot yield/reliability/process robustness issues, and analyze ecosystem data to drive continuous improvement and meet product milestones.

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FursaFursa
AMD
AMD
1 day ago

Advanced Package Integration Engineer — Server Products

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Drive package process development and product NPI for AMD EPYC server products. Own package planning, development, qualification, and execution planning across internal cross-functional teams and external suppliers. Lead global teams designing test vehicles and packages, identify technical and schedule risks, troubleshoot yield/reliability/process robustness issues, and analyze ecosystem data to drive continuous improvement and meet product milestones.
Location: Austin
Workplace: Hybrid
Employment Type: Full time
Job Function: Hospitality & Food Service

Key Responsibilities

  • •Define test-vehicle and product-package designs and create execution plans with cross-functional teams.
  • •Lead technology development and product NPI, coordinating milestones across geographies and suppliers.
  • •Identify technical and schedule risks and develop mitigation plans.
  • •Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
  • •Collect, analyze, and present data to drive technical decisions and continuous improvement.

Pay and Benefits

Salary: USD 127,190 - 218,040 annually

Key Requirements

  • •BS/MS/PhD in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering, or equivalent.
  • •Proven semiconductor packaging development experience, especially for advanced server products.
  • •Hands-on experience with advanced 3D and 2.5D package structures, wafer-level assembly, substrate assembly, RDL, bumping, composite materials, and polymers.
  • •Experience working directly with OSATs, material/equipment suppliers, and foundry partners.
  • •Demonstrated leadership driving cross-functional projects with internal teams and external suppliers.
Experience:Semiconductor packagingNPIAdvanced server productsOSATs3D and 2.5D packaging
Skills:Problem-solvingProject managementWritten communicationVerbal communicationRisk management
Tech Stack:Advanced 3D packaging2.5D package structuresWafer-level assemblySubstrate assemblyRDLBumpingOSATFoundry

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn