Career Accelerator Program - Packaging Engineer

Join the Career Accelerator Program to accelerate your ramp into TI through professional and technical training plus hands-on learning. In this packaging engineering role, you’ll partner with teams to design and develop semiconductor packaging technologies (e.g., wirebond, flip chip, modules, SIPs), support product qualification and production, and help meet reliability, yield, and testability goals. You’ll also drive design of experiments and model electrical/mechanical/thermal behavior to reduce risk designs.