Package Silicon Technology Node Development MTS

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Product ManagementSkills: ["Cross-functional collaboration","Technology strategy","Risk mitigation","Execution excellence","Leadership"]

Drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions for next-generation memory products. Lead high-impact, cross-functional work across silicon, package, and system-level integration, ensuring technology readiness and risk mitigation across evolving design and process landscapes. Collaborate with global teams spanning fab process integration, product development, package design, assembly technology development, and global quality, using AI-based workflows to accelerate execution.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
1 week ago

Package Silicon Technology Node Development MTS

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions for next-generation memory products. Lead high-impact, cross-functional work across silicon, package, and system-level integration, ensuring technology readiness and risk mitigation across evolving design and process landscapes. Collaborate with global teams spanning fab process integration, product development, package design, assembly technology development, and global quality, using AI-based workflows to accelerate execution.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management

Key Responsibilities

  • •Define and drive CPI technology strategy and roadmaps for silicon node transitions.
  • •Ensure technology readiness and risk mitigation across design and process landscapes.
  • •Lead cross-functional technical collaboration across silicon, package, and system-level integration.
  • •Partner with global engineering teams spanning fab process integration, product development, package design, assembly technology development, and global quality.
  • •Shape future memory product success through technology innovation and disciplined execution.

Key Requirements

  • •Define and drive chip-package interaction (CPI) technology strategy and technology roadmaps for advanced silicon node transitions.
  • •Ensure robust technology readiness and risk mitigation across complex design and process landscapes.
  • •Provide high-impact, cross-functional technical leadership across global engineering teams (Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality).
  • •Operate at the intersection of silicon, package, and system-level integration to support next-generation memory product success.
  • •Demonstrate proficiency with AI-based workflows and AI tools in execution.
Skills:Cross-functional collaborationTechnology strategyRisk mitigationExecution excellenceLeadership
Tech Stack:AIAI-based workflows

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn