Advanced Packaging Process Support Engineer

Applied Materials
South Korea
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3-10 yearsEducation: bachelorsSkills: ["Responsibility","Diligence","Communication","Interpersonal skills","Root cause analysis"]

Provide high-visibility, customer-facing support for advanced semiconductor packaging equipment and processes, including on-site installation, qualification, troubleshooting, and process stabilization for KINEX bonding systems. Optimize die-to-wafer (hybrid) bonding processes, act as a process owner for hybrid bonding technologies, and design/execute DOE experiments. Analyze experimental data, perform root-cause analysis on complex equipment issues, and collaborate across customer and internal engineering teams to improve production yield.

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FursaFursa
Applied Materials
Applied Materials
2 months ago

Advanced Packaging Process Support Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live
Reposted: similar role first listed 3 months ago

Job Summary

Provide high-visibility, customer-facing support for advanced semiconductor packaging equipment and processes, including on-site installation, qualification, troubleshooting, and process stabilization for KINEX bonding systems. Optimize die-to-wafer (hybrid) bonding processes, act as a process owner for hybrid bonding technologies, and design/execute DOE experiments. Analyze experimental data, perform root-cause analysis on complex equipment issues, and collaborate across customer and internal engineering teams to improve production yield.
Location: South Korea
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Provide on-site technical support for Applied KINEX bonding systems, including installation, qualification, troubleshooting, and process stabilization.
  • •Support and optimize die-to-wafer bonding processes for advanced packaging applications.
  • •Act as a process owner for Hybrid Bonding technologies in collaboration with customer engineering teams.
  • •Design and execute process experiments/DOEs, analyze data, and deliver technical conclusions.
  • •Perform root cause analysis to resolve complex equipment and process issues and improve production yield.

Key Requirements

  • •Bachelor’s degree in Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, or a related field.
  • •3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging.
  • •Ability to work in physically demanding fab environments with a strong sense of responsibility and diligence.
  • •Strong communication and interpersonal skills for global collaboration and technical documentation.
  • •Experience supporting complex process/equipment issues and resolving customer product problems using structured root cause analysis.
Experience:3-10 yearsSemiconductorAdvanced packagingSemiconductor process engineeringEquipment supportAdvanced semiconductor packaging
Education:Bachelor's
Skills:ResponsibilityDiligenceCommunicationInterpersonal skillsRoot cause analysis
Languages:English
Tech Stack:Hybrid BondingKINEXDie-to-wafer bondingWafer-to-wafer (Fusion bonding)Chemical Vapor DepositionAtomic Layer DepositionPlasma Reactive Ion EtchPhysical Vapor DepositionAnnealImplantDRY& WET cleaningPlasma-related processesPlasma cleaning

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
Glassdoor
Glassdoor: 3.9
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