SR. HBM EQUIPMENT ENGINEER

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Experience: 3+ yearsSkills: ["Communication","Problem-solving","Continuous improvement","Cost reduction","Cross-functional coordination"]

Own equipment performance for HBM assembly processes by applying deep knowledge of key steps (e.g., flip chip/Cowos, wafer inspection/molding/grinding, thinning, reflow/debond, dicing/laser groove, NCF lamination). Diagnose and resolve assembly equipment issues, lead evaluation and optimization initiatives, and drive continuous utilization improvement and cost reduction. Support SPC/automation systems, portability between sites, supplier audits, and internal/external audits.

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FursaFursa
Micron Technology
Micron Technology
1 year ago

SR. HBM EQUIPMENT ENGINEER

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Last checked: 6 hours agoStatus: Live

Job Summary

Own equipment performance for HBM assembly processes by applying deep knowledge of key steps (e.g., flip chip/Cowos, wafer inspection/molding/grinding, thinning, reflow/debond, dicing/laser groove, NCF lamination). Diagnose and resolve assembly equipment issues, lead evaluation and optimization initiatives, and drive continuous utilization improvement and cost reduction. Support SPC/automation systems, portability between sites, supplier audits, and internal/external audits.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Identify, diagnose, and resolve assembly equipment related problems.
  • •Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process steps.
  • •Lead or participate in continuous utilization improvement and cost reduction activities.
  • •Validate and fan out baseline qualified processes, including new process, tools, and/or materials for new product introduction.
  • •Support FDC/RMS/APC/SPC, site-to-site portability, material supplier audits, and internal/external audits.

Key Requirements

  • •3+ years of equipment experience in HBM assembly processes such as flip chip/Cowos, wafer inspect/molding, thinning, reflow/debond, steal dicing/laser groove/NCF lamination.
  • •Familiar with at least one of the listed HBM process areas.
  • •TOEIC 600 or above to communicate with PDE/GQ global divisions.
  • •Ability to identify, diagnose, and resolve assembly equipment related problems.
  • •Ability to validate and fan out baseline qualified processes, tools, and/or materials for new product introduction.
Experience:3+ years
Skills:CommunicationProblem-solvingContinuous improvementCost reductionCross-functional coordination

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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