Sr. Manager Packaging Engineering
AMD
Markham
Workplace: HybridFull timeFunction: Hardware, Embedded & Systems EngineeringEducation: bachelorsSkills: ["AI/ML","Leadership","Stakeholder management","Communication","Team development"]Lead end-to-end packaging design execution for Data Center GPU/MI programs, coordinating cross-functional teams across design, Signal/Power Integrity, OSAT vendors, and program management. Drive operational excellence with AI-enabled methodologies, implement robust execution frameworks, and deliver high-performance, high-complexity package solutions on aggressive timelines.

