Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 147,000 - 202,500 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: mastersSkills: ["Problem-solving","Communication","Interpersonal skills","Self-starter"]

Design and optimize die-to-wafer hybrid bonding processes for silicon photonics and co-packaged optics. Collect and analyze data, perform hardware characterization, and run failure analysis to de-risk technology. Develop high-precision surface preparation, die placement/alignment, and post-bond characterization flows, including DOE-driven experiments to map process limits and trade-offs. Collaborate with vendors, suppliers, and R&D teams in the Photonics Platforms Business Group within the CTO Office.

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Applied Materials
Applied Materials
5 months ago

Process Engineer – Die to Wafer Hybrid Bonding

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Job Summary

Design and optimize die-to-wafer hybrid bonding processes for silicon photonics and co-packaged optics. Collect and analyze data, perform hardware characterization, and run failure analysis to de-risk technology. Develop high-precision surface preparation, die placement/alignment, and post-bond characterization flows, including DOE-driven experiments to map process limits and trade-offs. Collaborate with vendors, suppliers, and R&D teams in the Photonics Platforms Business Group within the CTO Office.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Develop die-to-wafer hybrid bonding processes, including surface preparation/plasma activation, high-accuracy die placement/alignment, and post-bond characterization.
  • •Integrate die-to-wafer bonding with adjacent process modules such as dicing/die preparation, die thinning, and inter-die gap fill and planarization.
  • •Design and execute DOE-driven experiments to understand process limits, sensitivities, and trade-offs.
  • •Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.
  • •Collaborate with vendors, suppliers, and multidisciplinary R&D teams to evaluate and de-risk hybrid bonding technology for photonic-electronic co-integration.
Travel: Low travel

Pay and Benefits

Salary: USD 147,000 - 202,500 annually
Equity and Bonus:Equity

Key Requirements

  • •M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
  • •Hands-on experience with die-to-wafer or wafer-to-wafer bonding.
  • •Experience with thin-die handling and alignment-critical processes.
  • •Direct process engineering experience on mainstream semiconductor equipment (e.g., plasma, wet clean, overlay/alignment).
  • •Proficiency in statistical analysis and process control using DOE/SPC (e.g., JMP).
Experience:Semiconductor manufacturingSilicon photonicsR&D
Education:Master's
Skills:Problem-solvingCommunicationInterpersonal skillsSelf-starter
Tech Stack:DOESPCJMPPlasmaWet cleanOverlay/alignmentFailure analysis

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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