Process Engineer – Die to Wafer Hybrid Bonding

Design and optimize die-to-wafer hybrid bonding processes for silicon photonics and co-packaged optics. Collect and analyze data, perform hardware characterization, and run failure analysis to de-risk technology. Develop high-precision surface preparation, die placement/alignment, and post-bond characterization flows, including DOE-driven experiments to map process limits and trade-offs. Collaborate with vendors, suppliers, and R&D teams in the Photonics Platforms Business Group within the CTO Office.