Package Silicon Technology Node Development Director/DMTS

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Executive & General ManagementEducation: mastersSkills: ["Technical leadership","Risk management","Cross-functional collaboration","Mentoring","Communication"]

Lead Micron’s Package Development Engineering efforts to define and execute chip-package interaction (CPI) technology strategies and roadmaps for next-generation memory silicon node transitions. Drive risk identification, modeling, and mitigation across increasingly complex design, process, and test landscapes, partnering with Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Quality. Influence global program execution, provide CPI reliability expertise, and mentor engineering teams.

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Micron Technology
Micron Technology
1 month ago

Package Silicon Technology Node Development Director/DMTS

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Last checked: 21 hours agoStatus: Live

Job Summary

Lead Micron’s Package Development Engineering efforts to define and execute chip-package interaction (CPI) technology strategies and roadmaps for next-generation memory silicon node transitions. Drive risk identification, modeling, and mitigation across increasingly complex design, process, and test landscapes, partnering with Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Quality. Influence global program execution, provide CPI reliability expertise, and mentor engineering teams.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management
Seniority: Director level

Key Responsibilities

  • •Define, develop, and maintain long-term CPI technology roadmaps aligned with advanced silicon node transitions
  • •Lead technology strategy and risk management frameworks to support future memory product launches
  • •Drive global technical initiatives to ensure alignment between silicon, package, and test vehicle readiness
  • •Establish and run CPI risk identification, modeling, and mitigation strategies across development cycles
  • •Align priorities, timelines, and resources with senior leadership, and influence decision-making with data-driven technical insights

Key Requirements

  • •Master’s or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or related technical discipline
  • •15+ years of experience in semiconductor technology development, packaging, or related fields
  • •Extensive experience with chip-package interaction and integration challenges, including electrical and physical failure mechanisms
  • •Experience with reliability testing, qualification, and screening methodologies
  • •Proven ability to lead complex, cross-disciplinary programs across global organizations and provide technical leadership/mentoring
Experience:Semiconductor technology developmentPackagingMemory technologiesReliability testing
Education:Master's
Skills:Technical leadershipRisk managementCross-functional collaborationMentoringCommunication
Tech Stack:Chip-package interaction (CPI)DRAMNANDNORReliability testingQualificationScreeningFailure analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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