Director, HBM RTL Design and Integration

Micron Technology
United States
Workplace: OnsiteFull timeUSD 177,000 - 348,000 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 15+ yearsSkills: ["Leadership","Communication","Organizational influence","Mentoring","Team building"]

Lead a team responsible for the RTL design, IP integration, and SoC-level delivery of next-generation HBM SoC logic dies. Drive technical strategy across product generations while translating architectural specifications into high-quality RTL and ensuring end-to-end correctness. Partner closely with architecture, verification, physical design, firmware, systems, and manufacturing to deliver manufacturable HBM solutions, manage trade-offs, and scale the team through best practices and hiring.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Director, HBM RTL Design and Integration

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Last checked: 20 hours agoStatus: Live

Job Summary

Lead a team responsible for the RTL design, IP integration, and SoC-level delivery of next-generation HBM SoC logic dies. Drive technical strategy across product generations while translating architectural specifications into high-quality RTL and ensuring end-to-end correctness. Partner closely with architecture, verification, physical design, firmware, systems, and manufacturing to deliver manufacturable HBM solutions, manage trade-offs, and scale the team through best practices and hiring.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Director level

Key Responsibilities

  • •Lead SoC RTL design and integration for HBM logic dies, including subsystem partitioning, IP integration, and SoC-level design convergence.
  • •Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams.
  • •Oversee SoC integration aspects including clocking, reset, power intent, configuration infrastructure, and system-level design correctness.
  • •Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs.
  • •Build, lead, and scale an RTL design and integration team, including recruiting, mentoring, and retention of top engineering talent.

Pay and Benefits

Salary: USD 177,000 - 348,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVisionPaid Time-offPaid HolidaysParental Leave

Key Requirements

  • •Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes (e.g., TSMC).
  • •Deep expertise in RTL design, SoC integration, and full RTL-to-GDS flows, including synthesis, timing, and signoff considerations.
  • •Experience integrating complex IP subsystems (controllers, NOC, microcontrollers, PHY-adjacent logic, RAS, MBIST, interfaces).
  • •Familiarity with EDA tools and scripting languages (SystemVerilog, Python, TCL).
  • •Knowledge of DRAM/HBM systems and JEDEC standards preferred.
Experience:15+ yearsSoC designRTL-to-GDSHBMSemiconductor
Skills:LeadershipCommunicationOrganizational influenceMentoringTeam building
Tech Stack:SystemVerilogPythonTCLRTL-to-GDSSynthesisTimingSignoffEDA toolsJEDEC

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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