Advanced Packaging Integration Engineer

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 138,000 - 190,000 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: mastersSkills: ["Communication","Interpersonal skills","Collaboration","Problem-solving","Root-cause analysis"]

Lead process integration for high-performance optical interconnects and co-packaged optics, enabling advanced packaging and 3D integration technologies. Define and optimize integration flows (including 3D heterogeneous integration, die stacking, and hybrid bonding) to meet manufacturability, yield, and reliability goals. Run controlled experiments, perform root-cause analysis, and collaborate with foundries, OSATs, and internal design, process, packaging, and metrology teams to deliver production-ready solutions.

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Applied Materials
Applied Materials
5 months ago

Advanced Packaging Integration Engineer

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Last checked: 19 hours agoStatus: Live

Job Summary

Lead process integration for high-performance optical interconnects and co-packaged optics, enabling advanced packaging and 3D integration technologies. Define and optimize integration flows (including 3D heterogeneous integration, die stacking, and hybrid bonding) to meet manufacturability, yield, and reliability goals. Run controlled experiments, perform root-cause analysis, and collaborate with foundries, OSATs, and internal design, process, packaging, and metrology teams to deliver production-ready solutions.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Define, develop, and optimize advanced packaging process integration flows (e.g., 3D heterogeneous integration, die stacking, hybrid bonding) to improve performance, yield, and reliability.
  • •Lead and manage complex technical programs by driving schedules, resolving technical challenges, and ensuring on-time, high-quality deliverables.
  • •Design controlled experiments, collect and interpret data, perform root-cause analysis, and implement corrective actions.
  • •Collaborate with foundries, OSATs, and Applied Materials research teams to define and implement improved integration methodologies.
  • •Track industry and competitive advancements and apply new knowledge to drive innovation.
Travel: Low travel

Pay and Benefits

Salary: USD 138,000 - 190,000 annually
Equity and Bonus:Equity

Key Requirements

  • •M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM discipline.
  • •Hands-on experience in advanced packaging technologies such as hybrid bonding and semiconductor processing for 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
  • •Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).
  • •Strong communication and interpersonal skills to collaborate across multidisciplinary teams.
  • •Self-starter with strong problem-solving skills and the ability to work independently and in teams with minimal supervision.
Experience:Semiconductor processingSilicon photonicsAdvanced packaging3D integrationOptical interconnectsMicroLED
Education:Master's in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics (or related STEM discipline)
Skills:CommunicationInterpersonal skillsCollaborationProblem-solvingRoot-cause analysis
Tech Stack:JMPMESDOESPC

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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