Broadcom

2 weeks ago

IC Package Thermal Mechanical Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 14 hours agoStatus: Live

Job Summary

Design and validate thermo-mechanical models for advanced semiconductor packages for HPC, AI, and networking products. Split time between 70% multiphysics/FEA simulation work (stress, warpage, thermal cycling, delamination) and 30% hands-on reliability lab testing (electromigration, temperature cycling, drop tests). Automate workflows with Ansys APDL, Python, and MATLAB, using data analysis and ML/Gen-AI to improve reliability and yield from early definition through NPI.

Location: Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Field Service, Maintenance & Skilled Trades

Seniority: Mid level

Key Responsibilities

•Develop, perform, and validate advanced numerical FEA and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.
•Apply structural mechanics, fluid, and heat transfer knowledge to address chip-package and package-board interaction challenges.
•Automate simulation workflows by building reusable model-generation, post-processing, DOE, and reliability-data-analysis tools (e.g., using Ansys APDL, Python, MATLAB) and creating automated user interfaces with ML/Gen-AI.
•Conduct and oversee hands-on reliability lab testing to investigate package failure mechanisms and use experimental data to define and predict product reliability.

Pay and Benefits

Salary: USD 109,700 - 175,500 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityPaid Leave

Key Requirements

•Bachelor’s degree with 8+ years relevant industry experience, or a Master’s with 6+ years, or a PhD with 3+ years in Mechanical Engineering, Material Sciences, or a related field emphasizing solid mechanics.
•Deep understanding of electronic packaging structures and advanced materials, with ability to compare complex numerical simulations to first principles.
•Working knowledge of electromigration and semiconductor/IC packaging reliability.
•Hands-on expertise with major FEM tools, specifically ANSYS (Classic/Mechanical).
•Strong skills in Ansys APDL, MATLAB, and Python.

Experience:8+ yearsSemiconductorsIC packagingHPCAINetworking

Education:Bachelor's in Mechanical Engineering, Material Sciences, or related field

Skills:Problem-solvingAnalysisAttention to detail

Tech Stack:ANSYSAnsys APDLPythonMATLABFinite Element Analysis (FEA)FEMIcepakFlothermMachine LearningGenerative AIDesign of Experiments (DOE)

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

Loading job details...

Preparing the role view and application actions.

Broadcom

2 weeks ago

IC Package Thermal Mechanical Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 14 hours agoStatus: Live

Job Summary

Location: Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Field Service, Maintenance & Skilled Trades

Seniority: Mid level

Key Responsibilities

•Develop, perform, and validate advanced numerical FEA and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.
•Apply structural mechanics, fluid, and heat transfer knowledge to address chip-package and package-board interaction challenges.
•Automate simulation workflows by building reusable model-generation, post-processing, DOE, and reliability-data-analysis tools (e.g., using Ansys APDL, Python, MATLAB) and creating automated user interfaces with ML/Gen-AI.
•Conduct and oversee hands-on reliability lab testing to investigate package failure mechanisms and use experimental data to define and predict product reliability.

Pay and Benefits

Salary: USD 109,700 - 175,500 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityPaid Leave

Key Requirements

•Bachelor’s degree with 8+ years relevant industry experience, or a Master’s with 6+ years, or a PhD with 3+ years in Mechanical Engineering, Material Sciences, or a related field emphasizing solid mechanics.
•Deep understanding of electronic packaging structures and advanced materials, with ability to compare complex numerical simulations to first principles.
•Working knowledge of electromigration and semiconductor/IC packaging reliability.
•Hands-on expertise with major FEM tools, specifically ANSYS (Classic/Mechanical).
•Strong skills in Ansys APDL, MATLAB, and Python.

Experience:8+ yearsSemiconductorsIC packagingHPCAINetworking

Education:Bachelor's in Mechanical Engineering, Material Sciences, or related field

Skills:Problem-solvingAnalysisAttention to detail

Tech Stack:ANSYSAnsys APDLPythonMATLABFinite Element Analysis (FEA)FEMIcepakFlothermMachine LearningGenerative AIDesign of Experiments (DOE)

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn