ENGINEER, PRODUCT QE_PQA2 PARAM/WLR

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: high_schoolSkills: ["Problem-solving","Root cause analysis","Quality culture","Collaboration","Leadership"]

Drive product and process quality for DRAM/NAND/NOR manufacturing by managing MRB/CAPA activities, burn-in monitoring, RMA analysis, and event/fab process improvement. Develop WLR and PARAM programs across NPI/HVM phases, improve outgoing quality control, and manage new product/customer sample delivery. Lead reliability-metric reporting via global dashboards, perform root-cause analysis using tools like FMEA/8D, and collaborate cross-functionally while coaching the NPI_WLR team.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

ENGINEER, PRODUCT QE_PQA2 PARAM/WLR

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live
Reposted: first listed 6 hours ago

Job Summary

Drive product and process quality for DRAM/NAND/NOR manufacturing by managing MRB/CAPA activities, burn-in monitoring, RMA analysis, and event/fab process improvement. Develop WLR and PARAM programs across NPI/HVM phases, improve outgoing quality control, and manage new product/customer sample delivery. Lead reliability-metric reporting via global dashboards, perform root-cause analysis using tools like FMEA/8D, and collaborate cross-functionally while coaching the NPI_WLR team.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Manager level

Key Responsibilities

  • •Manage MRB case activities and conduct postmortems to enhance CAPA.
  • •Monitor wafer level burn-in and perform shift-left probing for coverage; manage RMA analysis for process improvement.
  • •Develop WLR and PARAM programs to monitor fab process reliability and drive improvements during NPI/HVM.
  • •Improve outgoing quality control (wafer surface, pad performance defects) and manage new product/customer sample delivery timing.
  • •Perform root-cause analysis across multiple data sources, drive quality-metric improvements (including OQRM/RMAs), and lead the NPI_WLR team’s performance objectives, feedback, and training plans.

Key Requirements

  • •Electrical/Electronics Engineering, Materials Science and Engineering, or Physics background.
  • •Understanding of electrical device parameters and how they relate to the fabrication process.
  • •Knowledge of statistical methods, data analysis, and data mining.
  • •Understanding of electrical failure analysis and reliability mechanisms for semiconductor/memory devices.
  • •Experience with root-cause analysis for RMA and familiarity with FMEA or 8D processes.
Experience:SemiconductorMemoryManufacturing
Education:High School in Electrical or Electronics Engineering; Materials Science and Engineering; Physics
Skills:Problem-solvingRoot cause analysisQuality cultureCollaborationLeadership
Tech Stack:CAPAMRBPostmortemBurn-inRMA8DFMEAOQRMReliability dashboardsData analysisData miningAI literacy

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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