Advanced Packaging Integration and Simulation Intern

Intel
Phoenix
Workplace: HybridInternshipUSD 120,898 - 120,902 annuallyFunction: Healthcare (Clinical, Medical, Wellness)Education: phdSkills: ["Collaboration","Data analysis","Technical communication","Presentation skills","Root-cause analysis"]

Collaborate with Intel researchers and engineers to develop and assess next-generation advanced packaging architectures for semiconductor systems. Support wafer- and package-level integration, define experiments (DOE), and build/calibrate simulation models to study thermo-mechanical behavior, interconnect quality, and thermal performance. Analyze data to identify root causes and recommend improvements, and present findings through technical presentations and potential publications.

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Intel
Intel
3 days ago

Advanced Packaging Integration and Simulation Intern

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Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live

Job Summary

Collaborate with Intel researchers and engineers to develop and assess next-generation advanced packaging architectures for semiconductor systems. Support wafer- and package-level integration, define experiments (DOE), and build/calibrate simulation models to study thermo-mechanical behavior, interconnect quality, and thermal performance. Analyze data to identify root causes and recommend improvements, and present findings through technical presentations and potential publications.
Location: Phoenix
Workplace: Hybrid
Employment Type: Internship
Job Function: Healthcare (Clinical, Medical, Wellness)
Seniority: Intern level

Key Responsibilities

  • •Support advanced packaging integration across wafer-level and package-level process flows, including 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules.
  • •Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance.
  • •Build, calibrate, and apply simulation models to evaluate mechanical characteristics, interconnect quality, and thermal performance.
  • •Conduct thermo-mechanical simulations to assess material responses to temperature, stress, and package-level loading conditions.
  • •Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvement paths, presenting findings through technical presentations and potential publications.

Pay and Benefits

Salary: USD 120,898 - 120,902 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Pursuing a PhD degree in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline.
  • •Available to work full-time for the duration of a 3-month internship.
  • •3+ months of academic or professional experience in laboratory experimentation, engineering data analysis, or simulation/modeling workflows.
  • •Experience with process integration or hands-on module development.
  • •Programming or data analysis experience using Python, MATLAB, JMP, R, or similar tools, plus statistical analysis/DOE or machine learning for engineering applications.
Experience:SemiconductorsAdvanced packagingHeterogeneous integrationWafer-level packagingChiplet integration
Education:PhD / Doctorate in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering (or closely related STEM)
Skills:CollaborationData analysisTechnical communicationPresentation skillsRoot-cause analysis
Tech Stack:PythonMATLABJMPRDesign of Experiments (DOE)Machine learningFinite element analysisThermo-mechanical simulationData analytics

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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